FlexTRAK™ CD Plasma System

Features and Advantages

  • Even treatment of plasma
  • High throughput
  • User-friendly graphical user interface (GUI)
  • Front pullout shelves for quick access to service parts
  • High volumes with a compact design and low ownership cost

Increased Quality of Plasma Processing with a Small Footprint but High Throughput

The FlexTRAK™ CD platform is a system which is meant to facilitate the processing of lead frame strips, laminated materials or other electronic parts in strip form, at a high rate of up to 5 strips per plasma cycle. Its plasma chamber has been designed for a highly uniform and repeatable process, to make sure that every bit of the substrate receives the same type of treatment, even as the parameters are carefully regulated to ensure that the results are always reproducible.

With this system, production becomes very flexible as a range of strip sizes can be handled. With the small size of the chamber and the unique control system to regulate the process, the cycle times are reduced while the machine runs unsupervised to a large extent.

Applications in Plasma Treatment

It handles plasma for pre-die attach, pre-wire bond, pre-mold encapsulation and pre-underfill processes, as in the following cases:

Removing Contaminants and Cleaning the Surface

  • Halogens like fluorine
  • Metals and metal oxides
  • Organic compounds

Etching and Surface Roughening

  • Better die adhesion and wire bonding
  • Better mold adhesion and less delamination

Surface Activation

  • Enhanced flow of die adhesive, elimination of voiding and better adhesion
  • Promotes the flow of mold material, eliminates voids and decreases wire sweep
  • Better underfill flow, eliminates voids and promotes adhesion, while boosting wicking speed

Specifications

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