Molding Solutions for Plastic Chip Encapsulation

Plastic Chip Encapsulation is a molding process that involves the capsulation of chips with Epoxy Molding Compound (EMC), which prevents the occurrence of physical damage or corrosion. During this molding process, wire bonding, which involves the interconnection between microchips and other electronics, is performed.

Additional procedures involved in this molding process include curing phenomenon of thermoset material, as well as controlling the management of process conditions.

Since there is a level of complexity associated with molding multiple material components due to EMC, chip, lead frame, and high wire density, there are numerous challenges associated with the chip encapsulation processes. These challenges can cause defects to arise in the mold, of which can include incomplete fill, air traps, voids, wire sweep, paddle shift and package warpage, to name a few.

The auto-meshing function supports the ease of completing encapsulation analysis. Moldex3D users are also given the option to adopt advanced manual meshing in the event that more complex components, such as undercut-shaped lead frames, are required.

Accurate simulation can improve design optimizing and cost management to ultimately avoid molding problems. Furthermore, potential molding problems can be immediately predicted and solved to ultimately help engineers to enhance their chip quality and prevent potential defects in a more efficient manner.

Product Portfolio and Features

● Essential features contained  ○ Optional features

Standard Package
Molding Process Transfer Molding
Mesh Technology  
Cadence Interface
Simulation Capabilities  
Flow, Cure, Warp
Thermal Analysis
Wire Sweep
Paddle Shift
FEA Interface
Solver Capabilities  
Parallel Processing 8
Material Test  
Viscosity (Rheometer)
Curing Kinetics (DSC)


Solution Add-On
Molding Process Compression Molding Underfill Post Mold Cure
Molding Process Compression Molding
No Flow Underfill (NUF)
Embedded Wafer Level Package (EWLP)
Capillary Underfill (CUF)
Molded Underfill (MUF)
Chemical shrinkage of material
Viscoelasticity stress relaxation
Material Test      
Specific Volume (PVTC)
Visco-elastics Modulus (DMA)
Contact Angle  


System Requirements: Supported Platforms

Platform OS

Windows/ x86-64

Windows 10 family
Windows 8 family
Windows 7 family
Windows Server 2008
Windows HPC Server 2008
Windows Server 2012


System Requirements: Hardware Recommendation

CPU Intel® Core i7 Processor
At least 1 TB of free space
CPU Intel® Xenon® E5 Processor
At least 2 TB of free space

Molding Solutions for Plastic Chip Encapsulation

Figure 1. Moldex3D Packaging offers users a complete series of molding solutions. In addition, Moldex3D supports various comprehensive solutions, some of which include Transfer Molding, Molded Underfill, Capillary Underfill (CUF), Compression Molding, Embedded Wafer Level Package (EMWLP) and No Flow Underfill (NFU)/ Non-conductive Paste (NCP).
Figure 2. Moldex3D IC Packaging can be used by designers to fully analyze the chip encapsulation process including filling, curing and cooling processes to advanced manufacturing processes that can include filter concentration, underfill encapsulation, post-molding curing, stress distribution and structural evaluation.
Melt front result in mold
In Wire Sweep Analysis, deformed wires are compared with original wires based on the wire sweep
Molding Solutions for Plastic Chip Encapsulation

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