Micromechanics Interface Module for Non-Linear Multi-Scale Material Modeling

The Moldex3D Micromechanics Interface (MMI) is a module that allows users to output an increased amount of material properties that are utilized for nonlinear multiscale material modeling. This module is a result of the integration between Digimat and Converse that is achieved prior to requiring FEA software.

Once the molding process simulation with composite materials is completed by using the Moldex3D, the MMI module solves complex nonlinear multi-scale finite element structural analysis procedures in a highly accurate and efficient manner. Furthermore, this module also carefully considers the unique material properties that have an affect on the multi scale model, some of which includes:

  • Anisotropic
    • Corresponds to the microstructure morphology
  • Heterogeneous
    • Corresponds to the microstructure morphology
  • Nonlinear, elasto-plastic
  • Fatigue
  • Failure
  • Strain-rate dependent
  • Visco-elastic

Challenges

  • The ability to attain various material properties induced following the molding process, such as:
    • Weld line
    • Fiber orientation
    • Residual stress
  • The ability to transfer material property variations of a molded part for FEA applications
  • The ability to evaluate the full procedure up to the advanced molding process, such as MuCell®
    • How this property can affect the structural performance of the mold part

Moldex3D Advantages

  • Interfaces with a direct selection of output items for both Digimat and Converse analysis prior to the use of FEA software
  • Supports structure analysis with the following software:
    • ANSYS
    • ABAQUS
    • MSC-Nastran
    • Marc
    • LS-DYNA
    • Radioss
  • Completely covers process-induced variation that occurs during the molding process
  • Output items include:
    • Fiber orientation
    • Weld line region data
    • Residual stress
    • Digimat-MAP
      • Maps the residual stress data and accounts it as a mechanical simulation input
    • Both EOP and EOC temperature distribution
    • Both part and part insert objects are included
    • Digimat can use temperatures obtained prior to and following the cooling step to perform warpage analysis

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