Gallium FIB-SEM System for Advanced Ultra-Thin TEM Sample Preparation - TESCAN S9000G

The TESCAN S9000G possesses the most advanced capabilities in nanofabrication for the optimal quality in challenging sample preparation. It is a gallium FIB-SEM system aimed at advanced ultra-thin TEM sample preparation, and other challenging nanofabrication tasks, which require ultimate resolution and the latest in ion optics and nanomachining capabilities.

The TESCAN S9000G is equipped with the Orage™ FIB column that delivers not only the highest standard in precision for nanofabrication, but also the ability to utilize high ion beam currents; thus, making it viable to perform large-volume sample analyses.

The TESCAN S9000G features the Triglav™ SEM column for ultra-high resolution with excellent performance, particularly at low electron beam energies, and enhanced in-beam detection system with filtering electron signal collection capabilities that opens the window to new contrasts and enhanced surface sensitivity.

It is controlled by the new Essence™ SW interface, which is designed with an application-oriented, user-friendly, and customizable layout as well as SW modules with automation capabilities for sample preparation. All features are aimed at optimizing control and throughput with exceptional ease.

Excellent performance and resolution at low ion beam energies allow the preparation of electron-transparent TEM specimens of sub-20 nm semiconductor devices with ultimate quality. Furthermore, high ion beam currents up to 100 nA permit site-specific, large-volume FIB-SEM tomography of biological specimens and materials with excellent contrast.

Key Benefits

  • Nanofabrication with ultimate quality
    Keeping up with an ever-increasing amount of FIB milling applications which call for low beam energies, the Orage™ column operates at energies down to 500 eV thus providing the possibility of gentle milling to complete tasks such as TEM sample final polishing with minimal amorphization.

    Surface preparation is possible for EBSD microanalysis, or delicate surface final polishing in delayering applications of sub-20 nm chips for the purposes of architecture characterization.
  • Guaranteed best conditions for microanalysis
    The new generation of Triglav™ also comes with adaptive spot shape optimization, which results in higher resolution at high electron beam currents. This feature is an advantage for quick analytical methods like EDS, WDS, and EBSD. Additionally, the Schottky FE gun is capable of producing beam currents up to 400 nA with rapid beam energy changes guaranteeing excellent signal for all microanalytical applications.
  • World-class quality in sample preparation
    The cutting-edge ion optics design in the Orage™ FIB column guarantees high resolution over the whole beam energy range, versatility, and best conditions for sample preparation.

    Yet, its excellent performance at low energies is what makes this column a world-class instrument for conducting the most challenging nanofabrication tasks, including the preparation of ultra-thin TEM specimens of sub-20 nm processes with ultimate quality after final low-kV polishing.
  • Maximum versatility in sample preparation to your lab
    Whether utilized at high currents for fulfilling large-volume milling requirements or low ion beam currents for fabricating delicate nanostructures, the Orage™ column – capable of generating maximum currents of up to 100 nA while preserving beam quality – provides incomparable versatility to satisfy a wide scope of FIB applications.
  • Optimal FIB performance and maximum precision with ease
    The Orage™ FIB column is fitted with an ultra-stable HV supply and precise piezo-driven aperture changer, which permits fast switching between FIB presets and excellent repeatability. Furthermore, a semi-automated spot-optimizing wizard enables users to easily select the best beam spot that optimizes FIB milling conditions for a certain application.
  • Improved and extended imaging capabilities
    The in-beam detection system in the next generation Triglav™ column has been optimized, resulting in over a three-fold enhancement of signal detection efficiency. Furthermore, the detection capabilities have been extended and energy-filtered axial BSEs signal collection is now attainable. This makes it possible to explore with new contrasts and gives enhanced surface sensitivity by selectively gathering low-loss BSEs.
  • Enhanced surface sensitivity and meaningful contrast
    Electron-signal selective detection capabilities available in the next generation Triglav™ column gives users total control on surface sensitivity and the choice to explore with different contrasts. Images containing topographic or material contrast, or both, can be gathered at the same time, for maximum insight of the sample in minimum time.
  • Complex applications easier than ever
    The new TESCAN Essence™ software platform is a simplified, multi-user user interface with a layout manager that allows fast and easy access to main functions. This user-friendly interface can be customized to best fit particular application, user skill level and preference.

    A wide range of SW modules, wizards and recipes make the FIB-SEM applications, easy and smooth experience for both expert and novice users, boosting productivity and contributing to increased throughput in the lab. The new TESCAN Essence™ also provides the Advanced DrawBeam™, vector-based scanning generator for fast and precise FIB machining and Electron Beam Lithography.
  • Fast 3D microanalysis
    The new and enhanced in-lens detection system permits quick image gathering, which in combination with high ion beam currents up to 100 nA, results in fast data acquisition for 3D ultrastructural studies and 3D microanalytical sample characterization.

    EBSD and EDS data can be gathered simultaneously during the FIB-SEM tomography and post-processed with software dedicated to obtaining 3D sample reconstructions that provide researchers in life sciences or nanomaterials with unique insight and concrete answers.
  • Large wafer analysis
    A large chamber, and optimal 60 ° objective geometry design, allows FIB and SEM analyses of 6 ” and 8 ” wafers at any location.
  • Making the most of ion beam capabilities
    A high-performance, fast, and efficient gas injection system (GIS) is crucial for all FIB applications. The new OptiGIS™ possesses all of these qualities and the S9000G can be equipped with up to six units of OptiGIS, or optionally, with an in-line multi-nozzle 5-GIS system that gives maximum versatility in multi-purpose installations.

    Additionally, different proprietary gas chemistries and proven recipes for planar IC delayering are also available.

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