The SENTECH SENDURO®MEMS applies ellipsometry and spectroscopic reflectometry to offer accurate and dependable measurement of thin film stacks. When wafers are loaded from typical cassettes, recipes perform the quality control measurements.
Double-sided wafers are often processed in MEMS and sensor production, necessitating backside protection. The SENDURO®MEMS delivers sophisticated edge grip technology for wafer backside protection.
The SENDURO®MEMS gains from the SENTECH wide-ranging expertise in thin film metrology, as proved by the comprehensive SpectraRay/4 software.
Backside Protection by Edge Grip Technology
The SENDURO®MEMS is designed to handle double-sided wafers. Edge grip wafer handling is available for wafers measuring 100 mm, 150 mm, and 200 mm. C-to-C automatic wafer handling is performed by pre-aligner, robot, and 25-slot cassettes.
Single-point and multi-point measurements are backed by up to 200 mm X-Y mapping. A 100 x 100 µm2 measurement spot is used for providing pattern recognition for microspot spectroscopic ellipsometry.
Complete Thin Film Analysis Software SpectraRay/4
The SENTECH SpectraRay/4 software operated the SENDURO®MEMS. It offers a high level of versatility in measuring the wide range of films and layer stacks, as it is common in MEMS and sensor production. The SECS/GEM software interface option backs up the communication between the Manufacturing Execution System (MES) and the QC equipment (SENDURO®MEMS).
The SENDURO®MEMS is engineered for repeated and accurate measurement of refractive index, film thickness, and extinction coefficient of materials applicable to sensor and MEMS fabrication:
- Silicon oxide, silicon oxynitride, silicon nitride
- Polysilicon, amorphous silicon
- Polyimide, photoresist
- Single films and layer stacks of these materials on silicon wafers, silicon membranes, SiC, GaN on silicon, silicon-on-insulator substrates, etc., used in sensor and MEMS production.
- Thin metal films of Pt, Al, Cr and conductive films of TiN, TCO, TaN, and ITO
The SENDURO®MEMS is a very economical metrology solution for quality control in MEMS and sensor production.
It is possible to configure the SENDURO®MEMS according to the demands of production control and QC—commencing with the most economical reflectometry measurements. More advanced layer systems may necessitate a spectroscopic ellipsometer tool or even an additional spectroscopic reflectometer. The SENDURO®MEMS can be set up using all these tools.
The SENDURO®MEMS can be set up with µ-spot measurements in ellipsometry and reflectometry, as well as pattern recognition that offers the precise measurement location. All measurements can be integrated using the edge grip technology.
SENTECH provides the all-inclusive SpectraRay/4 software for use together with the SENDURO®MEMS system.