Plasma Etching System - Sirus T2 Tabletop Reactive Ion Etcher (RIE)

The Sirus T2 Reactive Ion Etcher (RIE) from Trion Technologies is a basic plasma etching system designed to etch dielectrics and other films that require fluorine-based chemistries. The small footprint and robust design make it ideal for the lab environment.


  • MEMS
  • Solid State Lighting
  • Failure Analysis
  • Research & Development
  • Pilot Line

Standard Features of the Sirus T2 Reactive Ion Etcher

  • Sirus T2 reactor with 200mm bottom electrode
  • System controller (includes Pentium™ based computer and touch screen interface)
  • Two mass flow controllers
  • Automatic tuning with 13.56 MHz 600 watt RF generator
  • Emergency Off system
  • Automatic pressure control package (butterfly valve with capacitance manometer for pressure measurement)
  • 12 month limited warranty

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