DM56: Low Viscosity Demold Resin

Stensborg’s DM56 is an acrylate-based, quick UV curing resin developed particularly for use with the company’s Roll-2-Roll (R2R) and Roll-2-Plate (R2P) micro/nano imprint holoprinters.

Product Features

The DM56 has been developed as a low viscosity, fast curing resin. It can be used with both LEDs (365 to 405 nm) and iron-doped mercury lamps.

Technical Data Sheet of DM56

Table Source: Stensborg

Type Acrylate-based UV curing demold resin
Viscosity Low: 40 cP at 25 °C
Typical curing dose ~64 mJ/cm2

 

Suggested Applications

The DM56 has been created as a photoresist demold resin for developing working masters (WM) for the DeskTop HoloPrinter.

The resin can be utilized with several kinds of photoresists, for example, Shipley Microposit S1800 series photoresist. It functions well with imprint replications resins such as DM57 and DM41, and also with replication resins such as X29 and X30.

Substrates

After curing, the DM56 fixes on to an extensive range of substrates that include, but are not limited to, PVC, PET, and PC. It is worth noting that the substrate surface treatment, or lack of treatment, can affect the adhesion properties of DM56.

Storage and Handling

Handling

Suitable protective gear, including protective goggles and gloves, must always be used while handling the DM56 demold resin. In addition, usual procedures for treating chemicals should also be followed as per the resin’s material safety data sheet (MSDS).

Storage

The DM56 resin has a shelf life of a minimum of 12 months from the manufacturing date if it is stored in its original container without being exposed to direct sunlight, at temperatures ranging from 5 °C to 25 °C.

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