Treated Rolled Copper Foil

The Treated Rolled Copper is a tough pitch copper foil from JX Nippon Mining & Metals. This product can be supplied as copper foil (TPC Foil, HA and HA-V2 Foil, HG Foil​) or surface treatment.

Foil Products

The company offers an ideal copper foil to meet all kinds of customer requirements, with a broad range of treated rolled copper foil measuring from 6 μm (under development) to 150 μm. The stability and flexibility of treated rolled copper foil means that it is desirable for FPC products, which need high reliability.

Table 1. Source: JX Nippon Mining & Metals

Grade	Type	Features	Purity	Thickness (µm)
				150	105	70	35	18	12	9	6
High functionality	HA-V2 (OFC)	High flexibility Low repulsive force Ease of handling	Cu: At least 99.9% Ag:100ppm
High functionality	HA (TPC)	High flexibility Low modulus of elasticity	Cu: At least 99.9% Ag:190ppm
High functionality	HG (OFC)	High flexibility Circuit linearity Soft-etching patterning property	Cu: At least 99.9%
General	TPC (tough pitch copper) JIS:C1100	General	Cu: At least 99.9%

Application Examples

Image Credit: JX Nippon Mining & Metals

Production Process

Image Credit: JX Nippon Mining & Metals

“BHM Treatment”: Copper Foil with Surface Treatment for Fine Pitch and High-Frequency Performance

Several types of surface treatments are available to address customer requirements.

• Treatments are greatly analyzed corresponding with the needs for high frequency and fine patterning
• A  range of rust-proofing treatments obtain excellent resistance to chemicals, heat and soldering
• Fine and low roughness treatment achieves improved adhesion property to resin
• The BHM presents high frequency and fine pitch (under L/S=25/25 μm) and better FPC reliability. It can also be employed with HA, HA-V2 and JXEFL.
• BHM is a treatment that can be performed quick and obtain a high etching factor (EF)
• BHM delivers high-frequency by lowering the number of magnetic metals and simultaneously retains good FPC reliability

Image Credit: JX Nippon Mining & Metals

Table 2. Source: JX Nippon Mining & Metals

Evaluation subject	BHY-HA-V2	BHM-HA-V2
Peel Strength	1.3 N/mm	1.3 N/mm
Solder blister test After 85 °C 85% RH for 48 hr, Dipping 290 °C for 60 sec
Undercut test SPS 50 g/L 15 min dip