Electro-Deposited Copper Foil for Use in Flexible Printed Circuits

JX Nippon Mining & Metals generates their JXEFL series of electro-deposited copper foils for applications in flexible printed circuits. The foils are highly annealable and can be produced in several thicknesses.

Application Examples

Electro-Deposited Copper Foil for Use in Flexible Printer Circuits

Image Credit: JX Nippon Mining & Metals

Production Process

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Features

  • JXEFL consists of bigger grains compared to normal ED foil, and fewer grain boundaries imply less risk of cracking
  • JX provides various thicknesses of foil to meet a range of customer requirements
  • JX provides both RA and ED copper foils for FPCs and can denote the best solution for the customer
  • JX can indicate appropriate surface treatment to match the requests of customers.
  • An annealable copper foil with high-elongation
  • Top class of bendability as electro-deposited copper
  • Fine nodulation can be done on the smooth surface of the base foil
  • BHM or FX surface treatment can be employed for high frequency use
  • Outstanding peel strength with the base film in spite of low roughness

Thickness Lineup

Image Credit: JX Nippon Mining & Metals

Typical Properties

Product Thickness Tensile strength Elongation
(room temperature)
Peel strength
µm kg/mm2 % kN/m
JXEFL-V2 9 42 6 0.7
12 42 8 0.8
18 42 14 1.0
25 41 20 1.1
35 40 20 1.3
45 39 22 1.4
50 38 22 1.6
70 36 27 1.7

Source: JX Nippon Mining & Metals

Grain Structure and Nodule Side

Image Credit: JX Nippon Mining & Metals

Transmission Loss

Image Credit: JX Nippon Mining & Metals

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