Hypergrain® (HG) Copper Foils

Treated Rolled Copper is a tough pitch copper foil from JX Nippon Mining & Metals.

It is a recrystallized fine grain for increased fine pitch wiring.

  • Exceptional handling ability as a result of high stiffness even with thin foils
  • Increased elongation characteristics due to homogeneous deformation without constriction, leading to superior bendability
  • Better circuit linearity and affinity can be done for soft-etching patterning

Surface Treatment

Several types of surface treatments are available to address customer requirements.

  • Treatments are greatly analyzed corresponding with the needs for high frequency and fine patterning
  • A  range of rust-proofing treatments obtain excellent resistance to chemicals, heat and soldering
  • Fine and low roughness treatment achieves improved adhesion property to resin

Specification and Typical Properties

Table 1. Source: JX Nippon Mining & Metals

Grade Type Features Purity Thickness (µm)
150 105 70 35 18 12 9 6
High functionality
HG (OFC) High flexibility
Circuit linearity
Soft-etching
patterning
property
Cu: At least 99.9%            

The stability and flexibility of treated rolled copper foil means that it is desirable for FPC products, which need high reliability.

Application Examples

Treated Rolled Copper Foil from JX Nippon

Image Credit: JX Nippon Mining & Metals

Concept of this Material — Fine Pitch Capability

Linearity and soft-etching are of higher grade due to their recrystallized fine grain.

Treated Rolled Copper Foil from JX Nippon

Image Credit: JX Nippon Mining & Metals

Technical Superiority Compatible with Fine-Pitch Capability

HG possesses good flexibility due to its uniform elongation.

Treated Rolled Copper Foil from JX Nippon

Image Credit: JX Nippon Mining & Metals

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