TPC Foil (Tough Pitch Copper Foil)

Treated Rolled Copper is a tough pitch copper foil from JX Nippon Mining & Metals.

  • This is a standard rolled copper foil from JX Nippon Mining & Metals with ideal flexibility and vibration resistance properties.
  • Surface treatment is employed to improve adhesion performance and resistance to heat, rust and acid
  • The surface roughness is less than electro-deposited copper foil
  • The material is extensively used in flexible printed circuit products

Physical Properties

Table 1. Source: JX Nippon Mining & Metals

Type (Treating type - Foil type) BHY-T BHYX-HA GHY5-HA GHY5-HA-V2
IPC Grade Grade 8 (LTA-W)
Modulus of elasticity  
(GPa)   (resonance method)   
Before annealing MD 105 122 122 110
Modulus of elasticity Before annealing TD 120 140 140 140
Modulus of elasticity  After annealing(180 ℃/1 h)   MD 105 76 76 85
Modulus of elasticity  After annealing(180 ℃/1 h)   TD 100 76 76 85
Electrical conductivity (% IACS) 100 100 100 101
Resistivity (ohm-gram/m2) 0.154 0.154 0.154 0.153

 

Mechanical Properties

Table 2. Source: JX Nippon Mining & Metals

Type (Treating type - Foil type) BHY-T BHYX-HA GHY5-HA GHY5-HA-V2
IPC Grade Grade 8 (LTA-W)
Hardness (Hv) Before annealing Vickers 106 100 113 125
Hardness (Hv) After annealing (180 ℃/1 hr) Vickers 58 40 48 46
Tensile strength (MPa) Before annealing MD 440 500 500 500
Tensile strength (MPa) Before annealing TD 420 510 510 505
Tensile strength (MPa) at 180 ℃ MD 193 211 236 310
Tensile strength (MPa) at 180 ℃ TD 157 89 110 296
Tensile strength (MPa) After annealing (180 ℃/1 h) MD 210 145 145 150
Tensile strength (MPa) After annealing (180 ℃/1 h) TD 160 120 120 125
Elongation (%) Before annealing MD 1 2 2 2
Elongation (%) Before annealing TD 1 3 3 2
Elongation (%) at 180 ℃ MD 2 1 1 1
Elongation (%) at 180 ℃ TD 2 1 1 1
Elongation (%) After annealing (180 ℃/1 h) MD 10 8 8 8
Elongation (%) After annealing (180 ℃/1 h) TD 6 4 4 5

 

Other Equipment by this Supplier