Advanced Probe System with the SUMMIT200

The latest Cascade SUMMIT200 advanced 200 mm probe system is vital for quickly collecting high precision measurement data on single or volume wafers.

The SUMMIT200 probe station is designed for device characterization/modeling, R&D and niche production applications. It enables precision electrical measurements over temperature for ultra-low noise, RF, DC, mmW and THz applications, with semi-automatic and now wholly-automatic operation for the quickest time to accurate data.

PureLineTM technology is used in the next-generation probe system for achieving one of the lowest noise levels on the market. Low-leakage and low-capacitance measurements are greatly improved by the patented AttoGuard® and MicroChamber® technologies.

With a new and improved 200 mm fast stage, cassette handling up to 50 wafers, high throughput test features, and a wide temperature range of −60 °C to 300 °C, the R&D and test engineer, scientist or production operator have everything they need to get the job done quickly.

Contact IntelligenceTM, a remarkable technology that enables autonomous semiconductor testing, is supported by the SUMMIT200 probe station. An operator-independent solution to achieve highly-reliable measurement data at any time and temperature is provided by a powerful combination of innovative system design and sophisticated image processing.

The SUMMIT200 offers a sophisticated 200 mm probe station platform for rapid, highly accurate and high-volume measurements for present and emerging devices and ICs, with a wide range of applications and upgrade paths to meet any future needs.

*For measurement tasks that do not require the improved feature set described above, the SUMMIT200 platform is also available in various versions.

Key Features

SUMMIT200 Measurement Accuracy

  • PureLine, AutoGuard and next-generation MicroChamber technologies provide the best solution for high-accuracy IV/CV, low-noise and 1/f measurements.
  • With effective shielding, it is possible to reduce AC and spectral noise.
  • Unsurpassed RF/mmW measurement and calibration accuracy with integrated RF tools and WinCal
  • Shortest signal path test integration for accurate, thermally stable and low-error data collection

SUMMIT200 Measurement Accuracy

Image Credit: FRT Metrology

Productivity

  • The time it takes to get accurate data is x5 faster.
  • Increased test throughput thanks to a new 200 mm stage.
  • With VueTrackTM and High-Temperature Stability (HTS) technologies, high throughput UT/MT (Unattended Test over Multiple Temperatures) can be achieved.
  • Wafer handling automation with optional loader
  • Faster time to first data for standard and “hard to test” devices like a small pad, thin wafer and high power
  • eVue digital imaging system with improved fast set-up, optical visualization and in-die and wafer navigation
  • Automating tools that are extremely effective reduce the total amount of time spent testing wafers, singulated dies and modules

Productivity

Image Credit: FRT Metrology

Positioning Accuracy

  • Semi-automatic stage with 4 axes for precise positioning and repeatable probe-to-pad contact
  • With motorized positioners and VueTrack PRO, users can achieve sub-micron positioning and active thermal compensations.
  • Additional manual ergonomic controls for quick “hands-on” wafer positioning

Positioning Accuracy

Image Credit: FRT Metrology

Flexibility and Application-Tailored Solutions

  • Characterization of RF/microwave devices, 1/f, WLR, FA and design debug
  • Velox and analyzers/measurement software work together seamlessly
  • Probe positioners and probe cards are used to create complete solutions
  • The full thermal range of −60 °C to +300 °C versatile microscope mount system for fine-structure and large-area probing

Flexibility and Application-Tailored Solutions.

Image Credit: FRT Metrology

Thermal Measurements

  • ATT offers a wide range of highly efficient and dependable thermal chuck systems.
  • Flexibility ranges from hot only to a full temperature range of −60 °C to +300 °C.
  • With no compromise in transition times, this system uses up to 25% less air (CDA) than other systems on the market (300 l/minute).
  • Transition times are up to 15% faster than other systems on the market.
  • MicroVacTM and FemtoGuardTM technologies are patented and provide ultra-low noise measurements and leakage control, as well as low residual capacitance for repeatability and advanced measurement accuracy and speed.
  • Field-upgradable: Expands to meet the needs of the user

Thermal Measurements

Image Credit: FRT Metrology

Ease of Use

  • An operation that is both comfortable and ergonomic
  • Manual wafer access is quick and easy thanks to the locking roll-out stage
  • Velox provides simple on-screen navigation, wafer mapping and accessory and thermal system operation

Ease of Use

Image Credit: FRT Metrology

Velox Probe Station Control Software

  • User-centered design reduces training costs and increases productivity.
  • Compatibility with Windows 10, which allows for the best performance and safety when using cutting-edge hardware
  • Comprehensive alignment functions for autonomous semiconductor testing, ranging from simple wafer alignment and mapping to sophisticated probe-to-pad alignment over multiple temperatures
  • For inexperienced users, the operation has been simplified: A Workflow Guide and a condensed graphical user interface cut training costs
  • Loader integration — Effortless creation of workflows and receipts and no need for any additional software
  • VeloxPro option: SEMI E95-compliant test executive software that automates the entire wafer test cycle in a simple and safe manner

Velox Probe Station Control Software

Image Credit: FRT Metrology

Applications

  • MEMS
  • Failure Analysis
  • RF/mmW/THz
  • IV/CV
  • Silicon Photonics

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