Ion Beam Etch System: IonFab 300 IBE

The Oxford Instruments IonFab 300Plus provides the flexibility to conduct etching and/or deposition and maximize system utilization. The specifications of the system can be fine-tuned based on the specific application ensuring rapid and consistent process results. The systems can be scaled so as to be used in R&D as well as for batch production in a single tool. It is used in a wide range of processes especially in the optical coating and semiconductor industries.

The ion beam range enables functionality in a range of modes that include the following:

  • Ion beam etching (IBE)
  • Reactive ion beam etching (RIBE)
  • Reactive ion beam deposition (RIBD)
  • Chemically assisted ion beam etching (CAIBE)
  • Ion beam sputter deposition (IBSD)
  • Ion assisted sputter deposition (IASD)

The IonFab 300Plus ensures flexibility in a single tool and has the following features:

  • Ability to handle wafers from 100 mm/4 inch up to 200 mm/8 inch
  • Manual loading for certain one-off trials
  • Wafer handling options
  • Load-lock for more rapid trials, improved throughput and enhanced particulate control
  • Cassette-to-cassette loading/unloading for batch production
  • Can be combined with other process tools, which include Oxford Instruments' Plasma lab plasma deposition, etch and sputtering tools and FlexAL atomic layer deposition tools
  • Easy upgrade options to add a deposition or an etch source

The IonFab 300Plus incorporates a leading ion source and grid set technology, features of which are listed below:

  • Grids are such that they suit particular applications, exhibit high uniformity, high rate, and/or low energy
  • Specific deposition grid sets to suit a range of targets, offer superior utilization of target material with reduced contamination

The IonFab 300Plus can be easily installed at the site and can be used and maintained conveniently and has the following features:

  • Through-wall interface options allow the system to be sited in "grey area"
  • Ease of access to process chamber via doors at either end
  • Ease of maintenance with door-mounted ion sources
  • Compact footprint reduces clean room space needed

Standard applications and materials include the following:

  • IR detectors
  • CdHgTe (CMT) etch
  • VOx deposition and etch
  • Metal contact and track etch
  • Cu, Ni, Al...
  • Noble metals: Au, Pt, Pd...
  • Diffraction gratings
  • SiO2 'blazed' etch
  • Spintronics and MRAM
  • AR and HR coatings for laser bars
  • Telecom filters
  • III-V photonics etching
  • Thin film magnetic hard disk heads (TFMH)

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