Posted in | Machining

DeCapsulation of Microelectronic Packages with Buehler’s PetroThin

This video shows the DeCapsulation or Delidding process using PetroThin system from Buehler. DeCapsulation is very important process for failure analysis of semiconductors and microelectronics. This system is used for mechanical removal of polymer, ceramic and metal covered packages, such that die circuitry and interconnections are exposed for failure analysis.

Run Time – 2:50min

Decapsulation of Microelectronic Packages

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