New High Thermal Conductivity Adhesive System from Master Bond

Master Bond Inc., Hackensack, N.J. has developed a new two part adhesive system called EP21AN with a thermal conductivity in excess of 22 (BTU•in/ft²•hr•°F). It is an outstanding electrical insulator with a dielectric strength of >400 volts/mil and a volume resistivity greater than 1013 ohm-cm.

This easy to use adhesive has been formulated with a non-critical 1/1 mix ratio by weight or volume. It cures readily at ambient temperatures or more quickly at elevated temperatures.

Master Bond EP21AN features excellent adhesion to a wide range of substrates including metals, ceramics, glass and many plastics. Bonds exhibit outstanding dimensional stability and shrinkage upon cure is exceptionally low. Master Bond EP21AN is available in 1/2 pint, pint, quart, gallon and 5 gallon kits.

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