Lambient Technologies Principal and Co-Founder Huan L. Lee will give an address at the Society of Plastics Engineers’ SPE Thermoset TOPCON 2018 event, to be held in Indianapolis on Feb. 20 and 21, 2018. His talk will concern expanding applications for dielectric cure monitoring, the only mature testing method that allows users to obtain critical data on curing thermoset materials in situ, in real time, over the course of the entire cure. He will also discuss how dielectric cure monitoring can be applied across a range of materials and applications relevant to resin formulation in R&D,
outgoing product testing in QA/QC, and cure monitoring in manufacturing. Mr. Lee will also explain how the insights obtained through this technique are applicable in products ranging from nail polish and countertops to aerospace structures, automotive and marine parts, and wind turbine blades.
ABOUT THE SPEAKER
Huan L. Lee is an electronics engineer with more than 30 years’ experience designing instrumentation for the composites industry. He has graduate degrees from the Massachusetts Institute of Technology, where he was part of a research group that worked on dielectric cure monitoring. He is also a co-founder of Micromet Instruments, which first commercialized the technology developed at MIT. In 2008 he co-founded Lambient Technologies LLC with Stephen Pomeroy to advance the use of dielectric cure monitoring for thermosets and composites.
ABOUT SPE THERMOSET TOPCON 2018
The annual SPE Thermoset TOPCON connects all members of the thermoset material supply chain; from additives and chemicals, to resin and reinforcement suppliers, compounders, processors and OEMs. This conference is the only gathering in the U.S. dedicated entirely to thermosets.