innovative new laminate material from 3M
lets designers and manufacturers of high-speed digital printed circuit boards
achieve higher speeds while simplifying design tradeoffs.
When used as "power" and "ground" layers in a multilayer
PCB, 3M embedded capacitor
material effectively becomes a decoupling capacitor inside the board. Embedded
capacitance is more effective at decoupling high frequencies than surface mount
discrete capacitors. Designers can achieve their decoupling requirements in
less time and the reduction in discrete capacitors simplifies the task of board
3M's embedded decoupling
approach offers several advantages. It eliminates large numbers of decoupling
capacitors, increases useable board area, enables faster signaling, lowers radiated
emissions (EMI), and saves engineering time associated with power distribution
design and board layout.
The material consists of an ultrathin adhesive layer sandwiched between two
layers of copper foil. The patented adhesive formulation incorporates barium
titanate particles to achieve a high dielectric constant. The combination of
high dielectric constant and thinness delivers a capacitance of 5 nF/in2.
3M embedded capacitor
material has been the subject of many recent technical papers, including two
industry presentations in November. Copies of these papers, along with detailed
technical and performance data, are available at www.3M.com/embeddedcapacitor.
Fabricators also can request a Processing Guide at the site.
information on Barium Titanate