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Results 1 - 10 of 333 for Bonding agents
  • Supplier Profile
    DOPAG is the system provider for gasketing, bonding, sealing, potting, and automating. The dynamicLine is based on the newly developed dynamic mixing head with its innovative valve technology. With...
  • Supplier Profile
    Watkins & Associates, Inc. has supplied adhesives, release agents, and sealants to the aerospace, marine, and transportation industry for nearly half a century. Specializing in difficult to bond,...
  • Supplier Profile
    Specac manufactures an extensive range of FTIR Accessory, IR Polarizer, and Pellet Press Products for Atomic and Molecular Spectroscopy. These products include ATR Accessories, Specular Reflectance...
  • Supplier Profile
    Adhesives, Sealants, Coatings and Potting / Encapsulation Compounds Master Bond is a leading manufacturer of high-performance adhesives, sealants, coatings, potting and encapsulation compounds and...
  • Supplier Profile
    THINKY was founded in 1971 as a company manufacturing digital measurement instruments. We made inexpensive display devices using LEDs. THINKY's products proved to be highly popular, and by 1991...
  • Supplier Profile
    For 75 years, General Plastics has been a recognized pioneer in the plastics industry. It develops and manufactures high-density polyurethane foam products, including its signature rigid and flexible...
  • Article - 6 Oct 2010
    The Source 1600 is our most flexible Variable Frequency Microwave (VFM) system for process development and OEM system development, allowing remote cavity placement for in-situ and inline processing.
  • Article - 6 Oct 2010
    The demand for lighter, faster, smaller and less expensive products has led the electronics manufacturing industry to the use of new packaging techniques such as DCA and Chip on Board technology.
  • Article - 5 Oct 2010
    Variable Frequency Microwave (VFM) technology provides solutions for curing high performance adhesives, utilizing cost effective plastics while meeting design requirements.
  • Article - 5 Oct 2010
    The demand for lighter, faster, smaller and less expensive products has led the electronics manufacturing industry to the use of new packaging techniques such as Flip Chip technology.