Article - 5 May 2006
Existing Thermal Interface Materials (TIM) technologies comprise phase change materials (PCMs), solders, thermal greases or pastes, and thermally conductive adhesive tapes.
Article - 29 May 2020
In this interview, AZoM talks to Dr. John Sosa, CEO and Co-Founder of MIPAR Image Analysis, about micrograph analysis and deep learning.
Article - 21 Jan 2014
During the manufacture of semiconductor wafers, thickness measurement forms an important part of this process since it provides process engineers with the information required to ensure that...
Article - 28 Apr 2022
Shrinking the size of processor chips implies accommodating millions of transistors in a confined space. Although these chips enable faster computers, they come with a shortcoming of generating...
Article - 5 Jan 2022
This article considers the latest understandings and advances concerning atom chips in order to provide an overview of this technology.
Article - 25 Jan 2022
This article discusses the methods of non-destructive testing (NDT) applied to computer components, utilized for industrial safety and quality assurance purposes.
Article - 15 Sep 2020
In this interview, Gareth Powell, strategic marketing manager at Teledyne e2v, speaks to AZoM about how the 2M Mipi Optical Module can reduce the time and cost of development in AI and ADC...
Article - 13 Oct 2021
This article discusses how user-friendly AI technology makes deep learning accessible to all.
Article - 29 Mar 2021
Deep learning is set to alter the machine vision landscape in a big way. It is enabling new applications and disrupting established markets.
Article - 24 Jun 2016
Pure nickel is very hard, ductile, shiny, resistant to corrosion, and has a silvery-white color.