Search

Sort by: More Search Options
Results 31 - 40 of 1229 for Handling
  • Article - 16 May 2001
    Improved manufacturing processability compared with unmodified polyamide 6/6 grades. Relative advantages, disadvantages and applications are listed together with a table of typical properties.
  • Article - 11 May 2001
    Relative advantages, disadvantages and applications are listed together with a table of typical properties for this thermoplastic.
  • Article - 11 May 2001
    Ionomer has good low temperature toughness, with better barrier properties than those compared to Polyethylene’s. Relative advantages, disadvantages and applications are listed together with a table...
  • Article - 7 May 2001
    Cellulose proprionate (CP) is a derivative of cellulose when reacted with propanoic acid (the reagent).
  • Article - 7 May 2001
    Transparent, glossy and reasonably hard for a thermoplastic. Has reasonable impact resistance at low temperatures. Advantages, diadvantages and applications are listed together with a table of...
  • Article - 25 Apr 2001
    Similar to DAIP, but better resistance to alkalies. Lower temperature resistance (160°C/320°F compared with 180°C/360°F for DAIP). Tensile strength approximately 10% lower than DAIP.
  • Article - 30 Mar 2001
    Good heat resistance and tracking resistance. Often used as a coating or laminating resin.
  • Article - 14 Jun 2011
    Semiconductor process tooling is a specialized field that requires highly advanced techniques and machinery. Formagrind is one of the few select European companies that specializes in high quality...
  • Article - 27 Sep 2001
    Adding nanosized particles to polymers can enhance properties such as strength, modulus, thermal stability as well as decreasing gas permeability. Properties such as toughness and impact resistance...
  • Article - 30 Oct 2003
    Forging processes used in Australia such as open die, closed die, non-ferrous and cold and warm steel forging are outlined. Their applications and limitations are also described.