Article - 16 Jul 2010
Master Bond Inc. has developed the widest variety of flexibilized and toughened epoxies, silicones, polyurethanes, polysulfides and UV cures for special application requirements.
Article - 20 Jul 2009
Smaller packaged circuits and components create heat which affects the reliability and life of numerous electronic devices.
Bruker X-Ray Analysis designs and manufactures analytical X-ray systems for elemental analysis, materials research, and structural investigations. Our innovative solutions enable a wide range of...
Article - 2 Jan 2002
Properties such as high thermal expansion, low thermal conductivity and low machinability compared to other metals need to be taken into account when designing with stainless steels. Many of these...
Article - 7 Sep 2001
Electron beam curing is a viable and advantageous alternative to thermal curing for polymer matrix composites. Although it requires special materials it is faster, cheaper, can be used on thicker...
News - 10 Aug 2020
SAKOR Technologies Inc., a recognized leader in the area of high-performance dynamometer systems, announces that it recently provided a performance test stand for validating designs for new hydraulic...
News - 26 Nov 2019
TE Connectivity (TE), a world leader in connectivity and sensors, manufactures SWFR single wall heat shrink tubing which is a cost effective, highly flame-retardant, 2:1 shrink ratio tubing made of...
News - 21 Nov 2019
Master Bond EP29LPTCHT is a two component, low viscosity epoxy compound that can be effectively utilized for underfill and encapsulation applications. It does not need excessive heat for curing and...
News - 6 Aug 2019
SHENMAO America, Inc. is pleased to announce that it will exhibit at the 31st Annual Electronics Packaging Symposium- Small Systems Integration, scheduled to take place Sept. 5-6, 2019 in Binghamton,...
News - 11 Apr 2019
SHENMAO America, Inc. is pleased to announce that it will exhibit at the 2019 IEEE Electronic Components and Technology Conference (ECTC), scheduled to take place May 28-31, 2019 at The Cosmopolitan...