News - 4 Aug 2004
ASTM Committee G02 on Wear and Erosion has committed itself to standardizing the chemical-mechanical polishing process by creating a task group to develop a proposed new standard, tentatively titled...
Article - 20 Jan 2014
This article demonstrates the ability of the Single Particle Optical Sizing (SPOS) technique to perform quantitative analysis on CMP slurry health.
Article - 4 Nov 2014
This article describes how to measure the particle size distribution (PSD) of CMP slurries using single particle optical sizing (SPOS).
Article - 19 Nov 2010
CMP pad was fabricated by a pulsed electric current sintering method. The attachment of diamond grains after sintering was investigated to obtain a minimum requirement of TiC layer for a stronger...
Article - 6 Oct 2006
Silicon Carbide (SiC) is highly wear resistant and also has good mechanical properties, including high temperature strength and thermal shock resistance. Feldco International manufacture silicon...
Article - 1 May 2008
Finishes for aluminium are designed to either preserve an existing surface or promote a new one which is visually or functionally more desirable. This article covers mechanical finishes, chemical...
Article - 20 Jul 2006
Metallographic etching is the process of revealing microstructural details that would otherwise not be evident on the as-polished sample. The various etching processes are described.
Article - 20 Feb 2006
Tribology includes the methodical study of friction, lubrication, and wear. Tribology plays a critical role in diverse technological areas.
Article - 12 May 2005
Copper and copper alloys are amongst the most versatile materials available and are used for applications in every type of industry. Fabrication techniques, handling, storage and cleaning details are...
News - 29 Mar 2005
A new dielectric material, developed by researchers at the University of Illinois at Urbana-Champaign, could facilitate the use of copper circuitry at the chip level. The thermally stable aromatic...