Article - 1 Aug 2005
In medical technology, the quality and documentation standards are superior to those implemented in other branches of industry. Manufacturers of medical products have to ensure a uniformly high...
Article - 18 Aug 2004
During manufacture and assembly of products, there is a wide range of testing and inspection carried out to ensure the materials and items satisfy their specifications.
Article - 6 Jan 2004
Alumina/Silica/Boria or Al2O3 70/SiO2 28/B2O3 2 is one of a number of materials known as Nextel. This ceramic materials is used for fabrics and yarns. Chemical, electrical, mechanical and thermal...
Article - 24 Oct 2003
With automotive manufacturers using a range of different materials for body parts, life for paint manufacturers has become more difficult.
Article - 14 Jul 2003
The importance of structural integrity is outlined and ways in which the condition of structures can be monitored are covered from the perspective of SIMoNET. Typical applicatioms such as bridges,...
Article - 27 May 2003
Polyaramid fiber is an infusible, wholly aromatic polymer that can strictly be described as nylon T, T – but rarely is. Manufactured only as a fiber (by solution spinning) and is characterized by high...
Article - 19 May 2003
Polyaramid polyparaphenylene terephthalamide, is mnore commonly known by the tradenames Kevlar and Twaron. Chemical, mechanical, physical and thermal are provided for these generic materials. Specific...
Article - 24 Jan 2003
Boron is a light element which will react with metals to form borates. Its occurrence, applications, atomic properties, isotope distribution, ionisation potential, physical properties, electrical...
Article - 20 Jan 2003
Conventional testing of electronic connections calls for mechanical pulling and shearing. Outlined herein is a new non-contact, non-destructive technique using lasers to test bond integrity. The...
Article - 17 Jan 2003
The Venlo system from X-Tek provides a digital alternative to x-ray film non-destructive testing. The benefits, capabilities, resolution, penetration and design features of the system are outlined.