Article - 20 Jan 2003
Conventional testing of electronic connections calls for mechanical pulling and shearing. Outlined herein is a new non-contact, non-destructive technique using lasers to test bond integrity. The...
Article - 30 Nov 2001
Micro-impact testing is a repetitive technique for evaluating coating adhesion, toughness and resistance to erosive wear. It is able to simulate actual wear conditions more closely than other...
Article - 28 Sep 2001
Fillers such as carbon nanotubes and nanofibres can be used in polymer matrix nanocomposites. Matrices include polymers such as polyamides, polyesters, polycarbonates etc. Applications include...
Article - 18 Sep 2001
A calcium, coppert titanate material (CaCu3Ti4O12) material is being investigated at the BNL due to unusually high dielectric constant. It is able to store extremely large amounts of charge over a...
Article - 26 Jul 2001
This article provides details on how aluminium nitride is produced, key properties and its applications, including microelectronics.
Article - 15 Jul 2010
Master Bond Inc. fast cure epoxies, polyurethane, silicones, cyanoacrylate and UV Cure systems are widely employed by manufacturers seeking maximum efficiency and greater productivity.
Article - 28 May 2001
Processes such as plasma spraying, flame spraying and high velocity oxy-fuel spraying are briefly explained. Applications such as surface protection, wear and corrosion resistance, microelectronics,...
Article - 26 Jun 2009
Adhesive manufacturer Master Bond Inc is at the forefront of new product development to meet the ever increasing stringent specifications of the aerospace industry.
Article - 2 Nov 2016
Plasma, the fourth state of matter, has become a useful method for surface modification and deposition of various materials over the past three years. Plasma is used to prepare surfaces for...
Article - 30 May 2019
Using neutron reflectivity, insight can be gained on delamination origin & whether hydrogen is used in the fabrication of microelectronics interfaces.