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Results 1 - 10 of 908 for Semiconductor packaging
  • Supplier Profile
    EV Group (EVG) is a recognized technology and market leader for wafer processing equipment. The company targets advanced packaging, compound semiconductor/LED and silicon-based power devices, MEMS,...
  • Supplier Profile
    Dage was founded in 1961 and is a market leader in its chosen markets of Semiconductor and PCBA Manufacture.  It has an award winning portfolio of Bondtester and X-ray Inspection Systems for...
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    Nordson MARCH is the global leader in plasma cleaning and treatment equipment, and plasma applications technology. The company has been engaged in the plasma equipment business for more than 25 years...
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    Lambda Technologies is a capital equipment and applications development company applying microwave energy to provide total solutions for the processing of advanced materials. Our products employ the...
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    Sonix™ manufactures and markets 2 primary product lines - Scanning Acoustic Microscopes (SAM), and Non-destructive Imaging Systems (NDT). The scanning acoustic microscope offers...
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    ICOS designs and manufactures inspection equipment for semiconductor packaging and interconnected applications. It is a world-leading supplier of equipment for the visual inspection of IC's, before...
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    BV Thermal Systems produces standard chillers and heat exchangers including standard temperature (5 – 35°C), low temperature (-40 – +30°C) and extended temperature (-40 –...
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    HYPRES develops and commercializes superconductor integrated circuits (ICs)and systems that provide unparalleled performance advantages for government and commercial applications. A flagship...
  • Supplier Profile
    FRT is one of the world’s leading suppliers of 3D metrology for R&D and high-volume manufacturing. The FRT MicroProf® is well established in semiconductor front end, advanced packaging,...
  • Supplier Profile
    Nordson ASYMTEK is a world leader in automated fluid dispensing, jetting and conformal coating. We design and manufacture a full line of equipment for semiconductor package assembly, printed circuit...