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Topics Covered
Introduction
Our Most Popular Thermal
Cycling Systems
Master Bond Thermal Cycling Systems are Used
in a Wide Range of Applications
Packaged the Way You Need
It
New Thermal Cycling Resistant Adhesives, Sealants and
Coatings
About Master Bond
Master Bond
Inc. offers a wide variety of one and two
component adhesives, sealants, coatings, and potting and
encapsulation compounds specifically designed to resist exposure to thermal
cycling. These compounds consist of epoxies, silicones, polyurethanes,
polysulfides and UV cures.
Durable and tough, these formulations have excellent adhesion to similar and
dissimiliar substrates. They exhibit outstanding performance in low and high
temperature environments.
Specific grades offer:
- Thermal and electrical conductivity
- Superior electrical insulation properties
- Resistance to vibration, impact and shock
- Withstand exposure to moisture and a wide range of chemicals
- NASA low-outgassing approved
- Low shrinkage
- Low exotherm
- Optically clear
- Abrasion resistant
- Fast cures
- Easy application
- Comply with UL94V-0 specification
- Gap filling
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Master
Bond's popular thermal cycling systems are given below.
| Product |
Description |
| EP17HT |
This high temperature, one
part heat cured epoxy system exhibits temperature resistance to 650ºF, while
being able to withstand thermal shock and repeated thermal cycling. |
| EP21TDCNFL
|
Electrically conductive,
highly flexible, two part epoxy has service capabilities from 4K to 250ºF. Excellent for
thermal cycling and thermal mismatches. |
| MASTERSIL 803
|
One part, high temp, oxime
cured epoxy
possesses a clear silicone temp range up to 500ºF. Epoxy is
additionally able to stand up to thermal shock and vibration as well as
thermally cycle. |
|
Master
Bond thermal cycling systems are used in the following applications:
- For the bonding and sealing of a variety of substrates which exhibit
different coefficients of thermal expansion
- Distributed control systems
- To ensure electrical circuit continuity in aerospace
applications
- For the encapsulation of heat-generating devices and modules
- Thermistors
- Bonding of stress sensitive devices
- For a low modulus, low stress seal
- Assembly of heating elements
- To ensure joint and bond robustness in aerospace
applications
- Sealing heat exchanger tubes and endplates
- Protection of components
- Thermocouples
- Pumps
- Bonding of metal and fiber reinforced composites in aerospace
production
- For use with surface mount packages exposed to thermal cycling
- Potting of power supplies, coils, glass diodes, and other delicate
assemblies
- For low stress fiber optic connections
- To ensure panel substrate integrity in aerospace applications
|
- To protect sensitive components from microcracking
- Flexible bonding of engineering plastic substrates
- RTDs - bonding of magnet and speaker assemblies
- To bond aluminum skins to honeycomb core in aircraft structures
- To encapsulate delicate electronic components
- Electrical heating systems
- To protect machinery from high interfacial stresses induced by thermal
loading during fabrication and assembly
- Thermal power plants
- Slip plate assembly
- Plastic ball grid array assemblies
- Chip scale packaging
- Area array packages
- Solar array panels
- Solar cell circuits
- Internal combustion engines
- Assembly of modern communication satellites
- Packaging of stress sensitive semiconductor devices
- ABS systems
- Bonding flexible substrates and connectors
- Electric motors
- Control valves
- Fluid flowmeters
|
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We offer a wide array of packaging options to speed productivity, minimize
waste and save energy including:
- Quantities from grams to gallons
- Cans, bottles and jars
- Cartridges for manual and pneumatic guns
- Premixed and frozen syringes
- Bipaks for field service kits
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Master
Bond's new thermal cycling resistant adhesives,
sealants and coatings are given below.
| Product |
Description |
| Supreme 10HTFL
|
One component, no mix epoxy. Highly
flexibilized system, outstanding shear and peel strength. Forms bonds over wide
temperature range of 4K to over 350°F. Withstands severe thermal shock and
thermal cycling. |
| Supreme 3HT-80
|
One component, toughened low
temperature heat curing epoxy sealant featuring both high shear and high peel
strength. Will cure at 175°F (80°C) within 30 minutes and at 250°F it will cure
in 10 minutes. |
| Supreme
10AOHT-LO |
One component, thermally
conductive epoxy adhesives. NASA low outgassing approved. Serviceable from 4K to
400°F. Impact, vibration and shock resistant. Superior durability and toughness.
|
| EP51FL |
Two part, fast room
temperature curing epoxy adhesive. Recommended for use in cryogenic
applications. High peel strength system. Easy to use one to one mix compound.
Noted for its ability to withstand thermal and mechanical shocks. |
|
Master
Bond is a leading adhesives manufacturer offering high quality adhesives,
sealants, coatings, and potting compounds. Master Bond's
product line consists of epoxy adhesives, polyurethane, silicone,
cyanoacrylate and latex adhesives.
Master
Bond's structural adhesives, offer design flexibility and provide excellent
bonding performance with a vast array of 3,000 custom designed adhesives
formulations. Adhesive properties differ in viscosity, cure speed, chemical
and temperature resistance, strength, electrical and thermal conductivity.
Specific adhesives systems can be designed to meet USP Class VI
certification for medical use or NASA requirements for low outgassing. Master Bond
products are successfully implemented in medical, optical, aerospace,
electronic, and other hi-tech industries.
Source: Master Bond Inc.
For more information on this source please visit Master Bond Inc.