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Using Computer Tomography for 3D Board Level X-Ray Inspection

Using Computer Tomography for 3D Board Level X-Ray Inspection

A number of talented researchers have contributed to the development of the computerized tomography technique (CMT) as we presently know it. [More]
X-Ray Inspection Developments in Large Board Computer Tomography and Automation

X-Ray Inspection Developments in Large Board Computer Tomography and Automation

Over the last 10 years, 2D X-ray inspection technology has advanced significantly in capability. Such a technology has become an essential tool within the test regime of the electronics industry. [More]
Studying the Impact of Interfacial Voiding on Joint Strength of BGA Devices Using X-Ray Examination

Studying the Impact of Interfacial Voiding on Joint Strength of BGA Devices Using X-Ray Examination

Voiding calculations help in making accurate quantitative measurement of the total voiding within the solder joints. This kind of measurement, however, does not give data regarding the actual location of the voiding within the joint. [More]
Testing Quality using 3 and 4 Point Flexural Tests

Testing Quality using 3 and 4 Point Flexural Tests

Flexural test plays a vital role in the research and manufacture of reliable electric components and materials. It is used to study the ability of the material to refrain from deformation under stress. [More]
Evaluating Susceptibility of Printed Board Assembly Materials to Isolate Failure Modes

Evaluating Susceptibility of Printed Board Assembly Materials to Isolate Failure Modes

The transformation of tin-lead products to lead-free products has made a great impact on the printed circuit board industries and surface mount technology. This is also a key area of focus in other sectors such as consumer electronics, aerospace, military and telecommunications. [More]
Testing the Mechanical Integrity of Copper Interconnects using First Bond Ball and Stud Bump Pull Test Method

Testing the Mechanical Integrity of Copper Interconnects using First Bond Ball and Stud Bump Pull Test Method

Copper has become an accepted replacement for gold when it comes to interconnect material for stud bumps, wire bonds, and pillars. [More]
Testing Aluminium Ribbons Interconnects for Electronics Applications

Testing Aluminium Ribbons Interconnects for Electronics Applications

Basically aluminium ribbons are used as interconnects in an array of electronics applications such as high-frequency, power and solar operations and microwave devices. [More]
How to Overcome Passivation Layer Interference When Performing a Ball Shear Test on First Ball Bonds

How to Overcome Passivation Layer Interference When Performing a Ball Shear Test on First Ball Bonds

The difficulty experienced due to the passivation layer while carrying out a ball shear test on first ball bonds can be addressed with a solution provided by Nordson DAGE. [More]
Bond Testing of Wire Bonds within LEDs

Bond Testing of Wire Bonds within LEDs

Light emitting diodes (LEDs) provide a low maintenance and energy efficient form of illumination. These solutions are increasingly becoming the choice for lighting design, from display systems and architectural lighting systems through to automotive lighting, street lighting and medical equipment. [More]
Particle Analysis in Geology, Pollution and Wear Analysis with Energy Dispersive Spectroscopy

Particle Analysis in Geology, Pollution and Wear Analysis with Energy Dispersive Spectroscopy

For many years, automated SEM-based particle and feature analysis has been utilized in a number of applications such as technical cleanliness analysis and gunshot residue analysis. [More]