Packaging News

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Alcan’s Aluminium Front Bumper Beams Contribute to Opel Astra’s Safety System

3M Introduce High Performance Diamond Pad Polisher Conditioner for CMP of Semiconductors

3M Introduces New System for Ultrathin Wafer Backgrinding

ISG to Start Second Blast Furnace in Response to Demand for Coated Steel

Tetra Tech Win Contract to Relocate Steel Plant from USA to China

Next Generation Electronics Packaging Materials to be Developed Jointly by Kostat and Carbon Nanotechnologies

Equipolymers JV Approved and Operations Commenced

Ceradyne to Acquire ESK Ceramics

Stanelco Develop Biodegradable Air-Pillow Packaging System

WRAP Findings Indicate 71% of Plastic Film Could be Recycled in the UK

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