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New Structural Void Filling Compounds for Aerospace Manufacturers

Published on May 11, 2011 at 11:10 PM

3M Aerospace is changing the way aircraft components are manufactured with the introduction of 3M Scotch-Weld Structural Void Filling Compounds EC-3550 B/A FST and EC-3555 B/A FST.

These low-density void fillers help save time and costs in aircraft production by eliminating process steps, reducing worker time and speeding throughput. With a unique combination of easy dispensability and non-sag performance, Scotch-Weld low-density void filling compounds offer a number of productivity-enhancing advantages.

These Scotch-Weld compounds are lightweight, extrudable and pumpable, offering superior handling attributes and dispensability. The simplified preparation and cleanup for the compounds eliminates weighing, mixing and potential re-packaging, saving significant production time. With fast, direct application, the products reduce - and in some instances, eliminate - hand troweling and trapped air, helping to avoid pinholes, voids and porosity.

Scotch-Weld low-density filling compounds are fast-cure, non-brittle, non-sag materials that are easier to handle than traditional materials and resist chip-outs and breakouts. The products' non-sag properties allow application of the compound to multiple work pieces at one time. In addition, the products exhibit good paint retention and adhesive bond strength.
Along with cutting production costs and time, the compounds also help manufacturers comply with safety regulations for aircraft interiors. Stand-alone FR/FST compliance allows the products to pass inspection alone or in honeycomb panel construction. These compounds are formulated with non-halogenated and antimony-free flame retardants.

With less touch time and less cycle time, Scotch-Weld low-density void filling compounds help reduce part weight while cutting shop floor costs-valuable attributes for any aircraft manufacturer.

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