Dow Corning and SUSS MicroTec have declared that they have partnered on a temporary bonding solution for use in three-dimensional (3D) through-silicon via (TSV) semiconductor packaging application.
As per the signed agreement, the companies are developing an equipment system and material solution for large-scale production of 3D TSV packaged devices. SUSS and Dow Corning are jointly working to overcome the difficulties faced by the market in advancing the commercialization of 3D wafer level packaging (WLP) and 3D TSV packaging.
Dow Corning’s silicon-based material includes a release and adhesive layer. This material along with a bi-layered spin coating and bonding method is optimized for use in simple processing. The total solution with the help of standard manufacturing processes provides the benefits of simple bonding and is compatible with chemical and thermal demands for via middle and interposer TSV processing and rapid room temperature de-bonding processing needed for sophisticated packaging.
Semiconductor companies can minimize the form factor of semiconductor packages through the commercialization of TSV technology, and fulfill the continuous needs of the consumer for faster, smaller and thinner electronic devices. Vertical stacking of two or more chips with the help of TSV technology is one of the possible methods of minimizing footprint on the printed circuit board.
Dow Corning is known for silicon-based partnership and innovation in semiconductor packaging. The well-established worldwide infrastructure of the company ensures consistent support, supply and quality of adhesive for bonding and sealing, die encapsulants for use in stress relief and thermal interface materials for reliability and performance.
Source: http://www.dowcorning.com/