Everett Charles Technologies will exhibit the new HyperCore base material at the forthcoming SEMICON Taiwan Expo, which will be conducted at the TWTC Nangand Hall in Taipei, Taiwan, from September 5 to 7, 2012.
ECT ZIP HyperCore
HyperCore is an in-house base material designed for the fine-pitch, highly scalable ZIP probe series. The material does not require plating and demonstrates 600 Knoop hardness. It has resistance to tip deformation and wear usually produced by cleaning cycles and mass production. It can be cleaned repeatedly as it is non-plated, thus offering record probe life. Its RF behavior and contact resistance are equivalent to that of gold plated BeCu. For instance, the Z0-050 HyperCore demonstrates constant 50 mW resistance and more than 40 GHz bandwidth. The base material has also resistance to oxides like gold, thus delivering superior performance even in adverse conditions.
Everett Charles Technologies will also showcase its extensive portfolio of semiconductor products, which include Bantam and ZIP contacts. ZIP's high scalability solutions for wide-range of applications will comprise ZIP Z1 and Z2, ZIP SCRUB, ZIP KELVIN, ZIP SUPER SHORT, ZIP Extended Length, and Z8.
ZIP Z1 and Z2 are superior performance production contacts for typical high-speed applications in 0.3, 0.4, 0.5, and 0.8 mm pitches. The ZIP SCRUB pin has a patented scrub-action. Designs for BGA, pad and leaded applications offer a self cleaning penetrating motion per compression that lengthens the average time between cleaning cycles. ZIP KELVIN is suitable for voltage sensitive device tests or peripheral devices demanding sub-1 ohm resistance measurements, which are normal in high-power and RDSON applications.
ZIP SUPER SHORT is developed for 0.5 nH low impedance, high frequency testing. The ZIP Extended Length allows rapid customization of travel and OAL as high as 6.7 mm. The Z3 line is designed for applications that need a high degree of compliance for contacting strip packages and large devices. The Z8 is developed for burn-in applications. It features the same form factor as that of the Z1 and Z2 lines, thus enabling flawless shifting from lab characterization to mass production. The ZIP patented 2-D design has planar contact surfaces created by a novel production process, thus offering cost benefits and superior performance.
Source: http://www.ectinfo.com