By Nick Gilbert
Engent, provider of advanced microelectronics research and development, testing and manufacturing services, has been acquired by adhesives manufacturer, H.B. Fuller.
The pioneering development capacity, infrastructure for technical support and resources for testing of microelectronic devices from Engent will enhance H.B. Fuller’s growing presence in the electronics market. The adhesive solutions offered by H.B. Fuller primarily cater to the electronics industry. According to Jim Owens, President and CEO of H.B. Fuller, the electronics market is characterized by a wide range of technologies already developed and those in the offing. Jim Owens stated that through this acquisition of Engent, H.B. Fuller intends to capitalize the opportunities presented by the dynamic electronics industry to the maximum by leveraging the combined expertise of their adhesive development capabilities, worldwide reach and the microelectronics proficiency of Engent.
Engent is located in Norcross, Georgia. Established in 2003, the company has been offering specialized manufacturing, research and testing services for small form factor (SFF) electronics. Engent involves in all levels of the electronic miniaturization technology and caters to various industries adopting microelectronics such as the medical, military and industrial market segments. Clients of Engent range from entrepreneurial ventures to Fortune 50 organizations. In 2011, the revenue generated by Engent was US $10 million. The margins were much higher than the current margin of H.B. Fuller. Moving forward, the financial results of Engent will be incorporated with H.B. Fuller’s adhesives business segment for North America. The net revenue generated by the 125 year old H.B, Fuller company in 2011 is US $1.6 billion.