Goodfellow offers a new copper foam with pore sizes between 300 and 600 µm and a relative density of around 37%, providing a much higher surface area than traditional copper foams.
New microporous copper foam, with a relative density of around 37% and a very large surface area, is a powerful heat sink.
This microporous material is expected to be of particular interest to design engineers working in fields requiring heat exchange.
Microporous copper foam is unique in that it is produced by means of a lost carbonate sintering process. Pure copper powder is mixed with a carbonate powder, compacted and sintered. This forms a matrix of copper ligaments, in between which is the carbonate powder.
After cooling, the carbonate is dissolved away in water and recycled or decomposed using heat. The resulting structure is regular and uniform throughout, giving a rigid, highly porous and permeable structure with a controlled density of metal per unit volume.
Applications of microporous copper foam include but are not limited to:
- Liquid cooling
- Air cooling
- Heat exchangers
- Board-level electronics cooling
- Power electronics
- EMI shielding
Goodfellow supplies microporous copper foam as disks and sheets ranging in thickness from 4 to 10 mm. Other thicknesses may be available upon request.
For more information about microporous copper foam from Goodfellow, contact the company at [email protected] or 0800 731 4653 (UK freephone) or +44 1480 424800. Visit the online Goodfellow Catalogue at goodfellow.com.
About Goodfellow
For more than 45 years, the Goodfellow name has been synonymous with small quantities of high-quality metals, polymers, ceramics and other materials that meet the research, development, and specialised production requirements of science and industry worldwide. Standard products can be found online at the comprehensive Goodfellow Catalogue (www.goodfellow.com). Custom products and materials in larger quantities are available upon request at [email protected].