New Wafer Bonding System Suits University and R+D Budgets

EV Group (EVG), a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications, today announced that it has launched an all-new EVG501 wafer bonding system to address rising cost burdens for its university and R&D customers.

Redesigned based on customer feedback, the EVG501 features the company's proven core technology platform used throughout its latest wafer bonding product portfolio -- but without some of the more expensive product features such as automation and temperature control not required in R&D environments. This improved, low-cost model wafer bonder completes EVG's product offerings spanning the entire manufacturing chain from R&D, small-scale production environments to full-scale, high-volume production.

Paul Lindner, executive technology director of EV Group commented, "The EVG501 is an integral addition to our product line-up. We've been committed to serving the world's top R&D institutions and universities for more than 25 years now, and we are thrilled to be adding yet another solution to our portfolio to address our customers' evolving needs. In fact, it is this commitment to our customers along with our superior customer service and support network that makes EV Group the partner of choice for smaller-scale production environments as well."

EVG501 Features

The EVG501 is a highly flexible R&D system that can handle small substrate pieces up to 200-mm wafers. The new tool supports a variety of bonding processes, such as anodic, glass frit, eutectic, diffusion, fusion, solder, and adhesive bonds, as well as other thermal processes, including oxide removal and high temperature bakes under a controlled atmosphere. The system also offers quick re-tooling with a conversion time of less than five minutes, making it ideal for R&D and small-volume production applications.

The EVG501 is available for purchase immediately.


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