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Newly Designed Structured Thermal Armor Helps Achieve Efficient Liquid Cooling Even Over 1000 °C

Newly Designed Structured Thermal Armor Helps Achieve Efficient Liquid Cooling Even Over 1000 °C

PEEK Materials Printed with FFF 3D Printing

PEEK Materials Printed with FFF 3D Printing

Fe Catalyst Oxidation with Varying Concentrations of Ethanol

Fe Catalyst Oxidation with Varying Concentrations of Ethanol

Bulk-Fill Resin Composites: Aqueous Environment Exposure and Accelerated Aging

Bulk-Fill Resin Composites: Aqueous Environment Exposure and Accelerated Aging

Ballistic Damage Mechanisms of Ceramic/Backing Plate Armor

Ballistic Damage Mechanisms of Ceramic/Backing Plate Armor

Carbon and E-Glass Fiber-Reinforced Geopolymer Composites

Carbon and E-Glass Fiber-Reinforced Geopolymer Composites

Bond Stress–Slip Behavior of BFRP Bars in Recycled Aggregate Concrete

Bond Stress–Slip Behavior of BFRP Bars in Recycled Aggregate Concrete

Physicochemical Properties of Soil After Application of Meat Processing Waste

Physicochemical Properties of Soil After Application of Meat Processing Waste

MycoBamboo: Use of a New Bio-Insulation Composite

MycoBamboo: Use of a New Bio-Insulation Composite

Cold Sintering Enables Multi-Material Integration for Better Solid-State Battery Production

Cold Sintering Enables Multi-Material Integration for Better Solid-State Battery Production

Researchers Develop First Superionic Conductor Based on Hydride Ion

Researchers Develop First Superionic Conductor Based on Hydride Ion

Oxygen-Substituted Lanthanum Hydride Shows Potential as an Efficient Hydrogen Carrier

Oxygen-Substituted Lanthanum Hydride Shows Potential as an Efficient Hydrogen Carrier

Nexeon Raises Significant Funding to Scale-up Production of Step Change Battery Materials

Nexeon Raises Significant Funding to Scale-up Production of Step Change Battery Materials

Instron® Introduces New 3400 and 6800 Series Universal Testing Systems

Instron® Introduces New 3400 and 6800 Series Universal Testing Systems

Nanoscribe Partners with PHIX to Drive Industrial Innovation in Photonic Packaging Market

Nanoscribe Partners with PHIX to Drive Industrial Innovation in Photonic Packaging Market

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