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Unlocking Atomic Layer Advantages in GaN and SiC Power Device Fabrication

Silicon nitride ALD via plasma techniques is crucial for GaN and SiC semiconductors, enhancing interface quality and enabling high-performance power devices.

From Oxford Instruments Plasma Technology 16 Jul 2026

Enabling Precision MISHEMT Fabrication with Atomic Layer Etch

This article examines atomic layer etch techniques for optimizing AlGaN layers in GaN HEMTs, enhancing device performance and reliability in power electronics.

From Oxford Instruments Plasma Technology 16 Jul 2026

KLA Instruments™ Introduces its Indentation University Series to AZo Materials

KLA Instruments presents a detailed nanoindentation training series, addressing key concepts and practical applications for academia and industry professionals.

From KLA Instruments™ 14 Jul 2026

Novel Experimentation Using InView™ Method Editor

With the InView Method Editor, nanoindentation evolves into a programmable platform, enabling precise evaluation of time-dependent mechanical properties.

From KLA Instruments™ 14 Jul 2026

The Future of Automated Chemical Synthesis

The Alicat IS-Max mass flow controller optimizes automated chemical synthesis by ensuring consistent hydrogen supply and enhancing process control and safety.

From Alicat Scientific, Inc. 14 Jul 2026

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