EV Group, the provider of lithography tools and wafer bonding equipment for the semiconductor, nanotechnology and MEMS markets, has bagged its first order from the compound semiconductor industry for its ZoneBOND technology. This is a temporary bonding/debonding (TB/DB) system launched by EVG in October 2011.
The foray into the compound semiconductor market is significant owing to the tremendous growth registered by this market in the face of sustained demand for mobile devices and smart phones.
According to Dr. Thorsten Matthias, business development director at EVG, the compound semiconductor market has always been a driving force for the pioneering of innovative temporary bonding/debonding technologies such as the solvent-assisted debonding, slide off debonding, tape debonding and finally the ZoneBOND technology. Over the last 10 years, EVG has supplied TB/DB tools to the compound semiconductor industry. In what is seen as a natural progression, the development of ZoneBOND now offers the compound semiconductor market standardization of tools and processes to carry out wafer processing by eliminating the last of the limitations posed to thin wafer manufacture.
The EVG ZoneBOND was initially developed to cater to the three dimensional integrated circuits (IC) mass manufacturing sector. The ZoneBOND equipment and processes have been availed by a leading semiconductor research company Fraunhofer IZM ASSID through a joint development agreement between the two companies. The advantages offered by the ZoneBOND technology other than process and equipment standardization are the capability to debond at room temperature, the compatibility with currently available adhesive platforms and their usage of glass or silicon carriers.