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Topics Covered
Master Bond Adhesive Systems
Advanced Adhesives for Medical Devices
Benefits of Adhesives in Overcoming Manufacturing Challenges
Thermoplastic and Thermosetting Adhesives
Techniques for Testing Performance and Characteristics of Adhesives
One-Component Adhesives
Two-Component Adhesives
Viscosities of Adhesives
Electrically-Conductive Adhesive Systems
Effect of Temperature on Adhesive Systems
Surface Preparation for Optimal Adhesion
Sterilization of Medical Devices
Materials and Adhesives Common to Medical Devices
Summary
New Epoxy Systems for Medical Devices
About Master Bond
Master Bond Adhesive Systems
Master Bond
Inc. has developed a wide variety of adhesives with a range of physical
strength requirements designed to best meet specific application needs. High
strength structural adhesives are available for metal to metal bonding uses
subjected to high stresses under hostile environmental conditions. Toughened
structural adhesive systems are available for uses where thermal cycling and/or
severe mechanical vibration stresses are encountered. Special formulations are
offered for bonding materials with widely different thermal expansion
coefficients such as glass to metal or plastic to ceramics. Compositions can be
designed to optimize shear strength, peel strength, fatigue resistance etc. as
desired. Many Master Bond formulations meet or exceed applicable MIL
specifications for high performance structural adhesives.
Advanced Adhesives for Medical Devices
Advanced
adhesives can improve the design of joints and the assembly of disposable
and reusable medical devices. A few of the more widely used joint designs for adhesively
bonding similar and dissimilar substrates. Lap joints work well in medical
device assemblies.The growth of high performance plastics has significantly
widened the options for designing and bonding disposable and reusable medical
devices. Assembling with adhesives can offer big cost and performance
advantages over traditional mechanical fasteners, such as screws and snap fits,
as well as other bonding methods, including welding, brazing, and soldering. The
increase of microelectronics in devices calls for greater use of adhesive bonding
of assemblies that are smaller and lighter than previous designs. What's
more, modern adhesives that perform well are now available and have posted
excellent safety records along with minimal environmental impacts.
The problem with traditional mechanical fasteners is that they become
increasingly difficult to apply when the joined components are small and thin,
such as sheet metal less than 0.01-in. thick. Also, skilled labor is usually
needed for joining small-diameter wires in devices such as fibrillators,
especially when they call for high reliability.
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Figure 1. A few of the more widely used joint designs for
adhesively bonding similar and dissimilar substrates. Lap joints work well in
medical device assemblies.
Benefits of Adhesives in Overcoming Manufacturing Challenges
Adhesives are available for a range of materials to resolve
manufacturing problems. They have the additional benefit of spreading mechanical
stresses over wide areas instead of point-to-point contact typical of mechanical
fasteners. Adhesives can also greatly reduce or eliminate corrosion
problems in the often hostile environments of human bodies and hospitals.
Modern, well designed, structural-medical adhesive compounds are used safely for
either disposable, or even reusable medical devices that must be sterilized,
especially when it involves contact with skin and other body parts.
Thermoplastic and Thermosetting Adhesives
These adhesives can be described as large-molecular weight polymeric
materials, commonly called plastics. They conveniently divide into thermoplastic
and thermosetting classifications. Thermoplastic
adhesives soften, melt, and flow when heated. They are readily processed by
injection molding, extruding, and calendaring as well as various casting
techniques. Other methods include solubility in carefully selected solvents, and
dispersion in water and other solvents called emulsions. Thermosetting
adhesives harden when heated. They are generally processed as liquids or
low-melt temperature solids.
Techniques for Testing Performance and Characteristics of Adhesives
Adhesive
test procedures per ASTM D1002 and D1878. All dimensions are in
inches.Today's medical devices involve assembling and joining many different
components made from plastics along with a wide variety of metals such as
aluminum, titanium, stainless steel, and copper as well as ceramics, optically
transparent materials, and semiconductors.
Successfully bonding medical components involves a thorough understanding of design
options for joining similar and dissimilar materials, performance
characteristics of the adhesive and substrate properties, assembly method,
including curing procedures, performance testing of the bonded joints for
assembled devices, and if required, appropriate sterilization procedures.
The test data for substrates bonded with selected adhesive compounds come
from carefully machined test specimens made in accordance with ASTM test
procedures and other recognized testing organizations. Physical test machines do
the pulling and peeling. Two widely used test procedures are ASTM D-1002, which
measures tensile-lap-shear strength, and ASM D1878 for measuring peel
strength.
Tensile shear strength determines the degree of adhesion to a substrate and
the bond rigidity. A peel-strength test finds the flexibility of the joint when
pulled apart in a tensile tester.
Many other tests are required to sufficiently describe an adhesive's
performance and characteristics designers should be aware of. They include
compressive strength, elongation, flexibility, hardness, dimensional stability,
thermal expansion, thermal conductivity, insulation resistance, resistance to
repetitive vibration, shock and temperature cycling as well as resistance to a
wide range of environmental conditions including exposure to water and various
solvents.
Also, resistance to sterilization is a primary consideration particularly for
reusable devices. Many medical applications are required to conform to USP Class 6
(for biocompatibility) and its ISO equivalents for device safety with minimal
decrease in performance.
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Figure 2. Adhesive test procedures per ASTM D1002 and
D1878. All dimensions are in inches.
One-Component Adhesives
One and two
component adhesives are available in a variety of packaging including cans,
bottle and syringes. Adhesives come as one or
two-component systems. One-component adhesives are easy to use because they need no
mixing. On their downside, they have a generally more limited application range
than two-component adhesives. While some single-component adhesives
are applied at ambient temperatures, most require heat cures to optimizing their
performance. The structural strength of one-component adhesives, such as
epoxy-resin-based formulations, is generally realized only after a cure at
elevated temperatures. Some can be stored at ambient temperatures for 12 months,
and longer with dry ice.
Two-Component Adhesives
Two-component adhesives generally have longer pot life, the
period after mixing during which the material can be applied. They cure at
ambient and more quickly at elevated temperatures. Two-component
adhesives can be frozen and stored in dry ice for extended periods before
use.
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Figure 3. One and two component adhesives are available
in a variety of packaging including cans, bottle and syringes.
Viscosities of Adhesives
An important property of adhesive selection is its viscosity before it cures. A simple
definition of viscosity is resistance to flow. Commercially available adhesive
systems have viscosities that range from water-like liquids to peanut butter.
The characteristic is generally measured in centipoises (cP) or millipascal-sec.
(mPa-s).
A viscometer is used to measure the flowability of an adhesive.Viscosity also governs the method that will apply the
adhesive. In general, a low-viscosity adhesive is readily applied at ambient
temperature with minimal pressure but may require containment or fixturing to
limit unwanted flow. Measurements are usually conducted at a constant shear
rate. Not surprising, viscosity greatly depends on temperature. As a rule of
thumb, for each 10°C increase in temperature, viscosity decreases by roughly 40
to 50%. Also, adding solid fillers such as silicas, and aluminas (used to change
the adhesive's properties) greatly increases viscosity. Highly filled adhesives are
called thixotropic. Flow is shear dependent, meaning viscosity decreases with a
high shear rate and is usually highest at rest. Additives are available to
adjust viscosity (flow) as may be necessary for some applications.
Probably the most widely used flow-control agents are finely divided high
purity silicas, some of which are coated with hydrophobic silicones to make them
easier to apply. However, most medical
adhesives do not contain inorganic fillers other than flow-control
agents.
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Figure 4. A viscometer is used to measure the flowability
of an adhesive.
Electrically-Conductive Adhesive Systems
Adhesives are formulated to be electrically conductive by
adding large amounts of silver, platinum, nickel, copper, or graphite. They can
cure at ambient for heat sensitive substrates or more quickly at elevated
temperatures.
Also available are one-component electrically-conductive systems which cure
between 200 to 250°F. Thermally conductive yet electrically insulating
formulations which contain thermally-conductive fillers (mainly aluminum oxide
or aluminum nitride) have been developed for specific medical uses. Radiopaque medical
adhesives are likewise available. They contain ceramic fillers such as
barium sulfate or bismuth salts.
Effect of Temperature on Adhesive Systems
Adhesives
for bonding components of medical devices cover a wide range of temperature
services from cryogenic to over 660°F for brief periods, such as, when wave
soldering or brazing. Cure schedules depend on the adhesive formulation, the
substrate temperature characteristics, time of exposure, amount of compound
used, and environmental conditions. Preferred high-performance-type structural adhesives can be cured from
ambient to as high as 400 to 500°F. The preferred range is about 250 to 357°F.
Here are a few pertinent temperatures and characteristics for a widely used
range of adhesives.
- Epoxy structural adhesives are recognized for providing the highest
physical-strength properties and outstanding versatility in widely different
applications from cryogenic to +500°F service.
- Polyamides and so-called liquid-crystal polymers may be considered
specialties particularly for high-temperature service.
- Polyurethanes are tough and flexible but are generally limited to 212 to
257°F service.
- Silicones feature unmatched flexibility and color stability in service to
500°F, but are considered to have limited strength, little abrasion resistance
at elevated temperatures.
- Cyanoacrylates offer unmatched cure speed and high strength for many
substrates, but lack toughness and flexibility. Usage is limited to 212°F.
- Thermoplastic adhesives are presently limited to joining plastics to each
other, or to metals and ceramics. Many exhibit limited service performance.
- Fluoropolymers offer the best chemical-resistance properties but exhibit
relatively low adhesive strength with service capabilities to 500°F.
- UV and light-curing adhesives are currently limited to applications in which
such light contacts the initially liquid composition. Then it cures in a few
seconds. A fast cure enhances productivity.
Surface Preparation for Optimal Adhesion
It's not surprising that the best adhesion or
bond requires properly prepared, cleaned, and roughened substrates. Physical
abrasive treatments and appropriate chemical cleaning, or both, are essential
manufacturing steps for achieving desired performance characteristics with most
metallic substrates. Specially formulated primer coats are also useful in some
applications. Be aware, however, that mold releases and surface treatments all
adversely affect adhesive performance and are considered contaminants. A great
deal of R&D has been carried out to develop suitable pretreatments for
metallic as well as nonmetallic substrates. An accompanying table details a few
recommended pretreatments.
Sterilization of Medical Devices
Autoclaving is one of the many methods available for sterilizing
medical devices. Biocompatibility and sterilization are among the most
important factors for bonding medical components to assure the safety of patients
and hospital personnel. Medical devices conveniently divided into disposable and
reusable products. Most disposable plastic materials for medical devices are
thermoplastics such as polyethylene, polypropylene, ABS, and polyvinylchloride.
Reusable devices from plastics are possible thanks to particular thermosetting
epoxy compounds.
Test and performance criteria include USP VI and more importantly ISO VI
protocols as well as ISO10993. These and other regulations describe systemic and
intracutanacious in vivo and in vitro testing, in vivo implant tests, and
certain animal tests.
But passing these tests is not sufficient for obtaining FDA approval. The
agency's requirements depend on specific applications and may well require
additional testing. Conformance to the USP VI test protocol and biocompatibility
tests are a good indication of the suitability and toxicological safety of a
proposed adhesive component for a medical device. Depending on the medical
device, sterilization may be required before and after applying the
adhesive.
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Figure 5. Autoclaving is one of the many methods
available for sterilizing medical devices.
Table 1. Sterilization methods for bonded medical devices
|
Sterilization |
Description |
Example adhesives
|
|
High energy radiation |
Isotopes, electron beam accelerators, x-rays |
EP62-1MED, EP30MED |
|
Autoclaving |
Steam usually 6 to 12 min at 130 to 140°C, and a specified
number of times. |
EP42HT-2, EP3HTMED |
|
Ethylene oxide |
Exposure at ambient or near ambient temperatures for specified
times, such as, over 10 hrs. |
EP21LV, EP41SMED |
|
Liquid sterilants |
Glutaraldehyde |
EP41SMED, EP21LV |
|
Plasma |
Hydrogen peroxide solutions |
EP42HT-2, EP30MED |
|
Corona discharge |
|
All medically approved adhesives |
|
Peroxide acid solutions |
|
All medically approved compounds |
Materials and Adhesives Common to Medical Devices
The materials and adhesives commonly used in medical devices are outlined in
table 2.
Table 2. Materials and adhesives common to medical
devices
|
Thermoplastics |
Thermosetting Plastics
|
Metals |
Ceramics |
Semiconductors |
|
Polystyrene |
Epoxies |
Aluminum |
Aluminum oxide |
Silicon |
|
ABS |
Thermoset polyesters |
Copper |
Magnesium oxide |
Germanium |
|
ABS |
Phenolics |
Stainless steel |
Silica |
Aluminum gallium arsenide |
|
Polycarbonates |
Polyimides |
Titanium |
Quartz |
gallium arsenide |
|
Polyethylene, polypropylene and copolymers |
Polyurethanes |
Nickel |
Aluminum oxide |
Silicon carbide |
|
Polyamides (Nylons) |
Silicones |
Cobalt |
Magnesium salts |
III-V semiconductors e.g. aluminum, gallium arsenide
phosphate |
|
Polyacetols |
Cyanoacrylates |
Silver |
Titanium oxide |
diamond |
|
Polyvinylchloride and copolymers |
Polysulfide |
Gold |
Graphite |
Tin sulfide |
Summary
Developments in medical adhesives are coming at a steady pace. A recent
introduction, for example, includes an ultra-fast, room-temperature curing ethyl
cyanoacrylate that bonds well to glass, ceramics, metals, rubbers and most
plastics. MB297 Medical is a high strength bonding compound in a one-component
system. UV-curable cyanoacrylates are also available.
Many medical-grade adhesives features a low viscosity of 2,000 to
2,400 cP making it easy to apply. Bond periods generally range from a few
seconds to less than 60 depending on atmospheric humidity and the substrates
being bonded. Some compounds need only contact pressure after applying
them.
Figure 6. The transparent MB297 cyanoacrylate adhesive
has a refractive index of 1.48, a Shore A hardness of 85, and excellent
resistance to most environmental conditions such as moderate heat, aging, and
many chemicals. It has a volume resistivity of 8.6 x1012 ohm-cm and a dielectric
constant of 3.5 at 1,000Hz.
New Epoxy Systems for Medical Devices
New Master
Bond two component epoxy system EP42HT-2ND2 MED BLACK cures at room temperature
and is resistant to repeated sterilization. This compound is colored black and
has a paste consistency. It meets USP Class VI requirements. Master Bond Inc.
also recently introduced EP3HTSMED. This one component epoxy system offers high
electrical conductivity, high shear strength and cures rapidly at elevated temperatures.
It is ideally suited for demanding manufacturing specifications.
About Master Bond
The Master
Bond product line offers over 3,000 different grades of specially designed
formulations. They differ in viscosity, cure speed, temperature resistance,
chemical resistance, strength, electrical properties, color etc. These products are
specifically designed to solve design, manufacturing and repair/maintenance
problems. They will increase productivity, reduce waste, save energy and improve
your products performance. They are the perfect solution.
Source: Master Bond
For more information on this source please visit Master
Bond