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Topics Covered
Background
Introduction
Features of Advanced Die Attach Epoxy Adhesives
Die Attach Products from Master Bond
Applications of Master Bond Die Attach
Adhesives
Reliability and Performance of
Master Bond Die Attach Adhesives
Electronic Grade Polymers
for Electronic Manufacturing by Master Bond
Background
Adhesive
manufacturer Master Bond Inc offers over 3,000 different grades of
specially designed formulations. They differ in viscosity, cure speed,
temperature resistance, chemical resistance, strength, electrical properties,
color etc. These products are specifically designed to solve design,
manufacturing and repair/maintenance problems. They will increase productivity,
reduce waste, save energy and improve your products performance. They are the
perfect solution.
Introduction
Master Bond's
advanced die attach adhesives are increasingly accepted for the most demanding
microelectronic semiconductor packaging as well as for chips-on-board assemblies.
Both one component heat curing and premixed and frozen formulations are available.
They include electrically and thermally insulative, thermally conductive, electrically
insulative and thermally-electrically conductive compounds. For special uses
fast curing two component systems are offered. They all offer outstanding bonding
strength for adhering components directly onto printed circuitry.
| Epoxies are the most widely used
polymeric materials for adhesives, sealants, coatings, pottings and
encapsulations and impregnants. They are available in both one and two
component systems. Two part systems can be cured at either room temperature
or elevated temperature. One part systems must be cured at elevated
temperatures (typically 250 - 300°F). One part systems curable by
UV light are also available.
|
Features of Advanced Die Attach Epoxy Adhesives
The Master Bond die attach epoxy compounds are 100% reactive and
do not contain any volatiles. They have excellent resistance to both thermal
cycling and mechanical shock and vibration. Their dimensional stability is
remarkable, even upon prolonged exposure to adverse environmental conditions.
These high performance epoxy compounds can be readily dispensed by syringes and
other conventional devices as well as by specialized printing technologies. For
certain optoelectronic uses unique UV curable compounds are employed as they
offer unmatched curing speeds and hence higher productivities.
- High Reliability
- Fast Curing
- Low Stress Void Filling
- Moisture & Chemical Resistant
- Reworkability
- Solvent Free
- Outstanding Adhesion to Mismatched CTE's
- Low Outgassing
|
- Tough
- Thermal Stability
- Exceptional Physical Strength Properties
- Adjustable Volume Resistivity
- High Thermal Conductivity
- Low Ionic Impurities
- Easily Dispensed
|
Die Attach Products from Master Bond
The following table summarizes Master Bond's
range of advanced die attach epoxy adhesives.
| Product |
Description |
| SUPREME
10HT/S |
One part, electrically conductive epoxy with low resistance. Good strength
properties. Cures at 125-150°C. Meets NASA low outgassing specifications and
offers superior temperature resistance. |
| EP65HT-1 |
Two part, rapid curing epoxy system with high temperature resistance. Gun
dispensable. |
| EP21TCHT-1 |
Fast curing at ambient or elevated temperatures. High thermal conductivity.
Electrically insulative. Meets NASA low outgassing
specifications. |
Applications of Master Bond Die Attach Adhesives
Master
Bond Die Attach Systems are for use in semiconductor packaging for medical,
military, communication, and general electronic assembly applications:
- Sic or GaN diodes and transistors
- Chip on Board or Multi Chip Module Applications
- Light Emitting Diode Assembly
- Optoelectronic Components
- High Power communication devices
- High power processors, memory, and ASICs
- Rectifiers
|
- Power Transistors
- Amplifiers
- Voltage regulators
- CMOS image sensors
- Microwave Devices
- Laser diodes for fiber optic devices
- RF Power Amplifiers for Wireless infrastructures
|
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Reliability and Performance of Master Bond Die Attach Adhesives
Master
Bond's die attach adhesives are designed to offer superior quality and long
term durability. They have earned a well deserved reputation for their
performance upon exposure to hostile environmental conditions. Select from a
wide range of systems conveniently packaged for ease of use. These compounds are
available in different viscosities, cure times, chemical resistances, electrical
properties, colors, etc. to best meet specific requirements. They are presently
employed in the assembly of many critical electronic devices used in commercial,
military, space and medical applications.
Electronic Grade Polymers for Electronic Manufacturing by Master Bond
Master
Bond’s line of microelectronic formulations consists of epoxies, silicones,
polyurethanes, acrylics and latex solutions. They include electrically
insulative, thermally conductive and electrically conductive systems. Both one
and two component compounds are available for use. These products are currently
employed in applications ranging from heat sinking to glob tops to surface
mounting. Many of these compounds have unique properties such as low thermal
expansion coefficients, exceptionally high thermal conductivity, low stress,
etc. Master Bond is also actively engaged in developing new
products to keep pace with the rapid technological advancements in the
microelectronic industry ranging from flip-chip technology to advanced
die-attach processes.
Master
Bond offers specialty systems for computers, telecommunications devices,
audio/video devices, avionics and aerospace applications, as well as automotive
manufacturing, interactive circuitry and advanced semiconductor equipment.
Source: Master Bond
For more information on this source please visit Master
Bond