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Lux Research's Study Finds Tranparent Conductive Films and Sensors as Hot Segments in Printed Electronics

Lux Research's Study Finds Tranparent Conductive Films and Sensors as Hot Segments in Printed Electronics

Transparent conductive films (TCFs) -- used in touchscreens -- and sensors are currently the hottest sectors in printed, flexible and organic electronics, based on an analysis of start-up companies' performance, according to Lux Research. [More]
Deca Achieves Milestone Shipment of 100-Millionth Wafer-Level Chip Scale Package Component

Deca Achieves Milestone Shipment of 100-Millionth Wafer-Level Chip Scale Package Component

Deca Technologies, an electronic interconnect solutions provider to the semiconductor industry, today announced that it has shipped its 100-millionth component. The company attributes this milestone to strong demand from portable electronics manufacturers for wafer-level chip scale packages (WLCSP) manufactured using Deca's unique, integrated Autoline production platform, which is designed to achieve faster time-to-market at lower cost. [More]
NASA ‘Create the Future’ Design Contest Sponsored by Mouser and Analog Devices

NASA ‘Create the Future’ Design Contest Sponsored by Mouser and Analog Devices

Mouser Electronics, Inc., a leading engineering resource and global distributor of semiconductors and electronic components, is sponsoring the 12th annual NASA Tech Briefs magazine “Create the Future” Design Contest, a challenge to engineers and students worldwide to create the next great thing. Mouser is being joined in this sponsorship by Analog Devices. [More]
Flexible Medical Implant Harvests Heart’s Mechanical Energy

Flexible Medical Implant Harvests Heart’s Mechanical Energy

An interdisciplinary research team including Northwestern University’s Yonggang Huang has developed a flexible medical implant that harvests the energy of the beating heart. Such a device could power pacemakers, defibrillators and heart-rate monitors naturally and reliably and reduce or eliminate the need for batteries. [More]
ATMI Celebrates Grand Opening of JangAn Manufacturing Facility in South Korea

ATMI Celebrates Grand Opening of JangAn Manufacturing Facility in South Korea

ATMI, Inc., a global technology company and supplier of advanced materials solutions to the microelectronics industry, cut the ribbon on their new manufacturing facility in JangAn, South Korea today at a Grand Opening Ceremony in the Gyeonggi province. Key customers, local government dignitaries, ATMI executives and employees, and media members from the region were in attendance to mark the occasion. [More]
Cascade Microtech’s CM300 Probe System Receives Best in Test Award

Cascade Microtech’s CM300 Probe System Receives Best in Test Award

Cascade Microtech, Inc., a leading supplier of solutions that enable precision measurements of integrated circuits at the wafer level, today announced that its CM300 Probe System was voted "Best in Test" in the category of Semiconductor Test. [More]
Lightwave Logic Acquires Rights to Corning's Organic Electro-Optical Materials

Lightwave Logic Acquires Rights to Corning's Organic Electro-Optical Materials

Lightwave Logic, Inc. has entered into a sole worldwide license agreement with Corning Incorporated enabling Lightwave to integrate Corning's organic electro-optical chromophores into Lightwave Logic's portfolio of electro-optic polymer materials. [More]
Reportlinker.com Adds Report on Advanced Materials for Displays

Reportlinker.com Adds Report on Advanced Materials for Displays

Reportlinker.com announces that a new market research report is available in its catalogue: Advanced Materials for Displays: Technologies and Global Markets [More]
ASE Collaborates with Inotera Memories for Strengthening its System-in-Package (SiP) Capabilities

ASE Collaborates with Inotera Memories for Strengthening its System-in-Package (SiP) Capabilities

Advanced Semiconductor Engineering, Inc., the world's largest semiconductor assembly and test service provider, today announced a joint development with Inotera Memories, Inc., a leading DRAM wafer foundry, in a move to further strengthen ASE’s System-in-Package (SiP) capabilities. [More]
imec and ROHM Semiconductor Partner to Develop ULP Radio Technology for Battery-Operated Wireless Devices

imec and ROHM Semiconductor Partner to Develop ULP Radio Technology for Battery-Operated Wireless Devices

Nanoelectronics research centerimec and ROHMSemiconductor Co. Ltd., aworld-leading supplier of electronic components, announced today that they have entered into a strategic partnership for research collaboration on ultra-low power (ULP) radio technology for small battery-operated wireless devices. [More]