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Ellsworth Adhesives Europe Announces Availability of Robnor Resins TCP091 Silicone-Free Paste

Ellsworth Adhesives Europe Announces Availability of Robnor Resins TCP091 Silicone-Free Paste

Ellsworth Adhesives Europe is pleased to confirm availability of TCP091 - Robnor Resins newly launched silicone-free paste. This new product has been specially formulated to provide efficient and reliable heat transfer across the interface between electronic components. [More]
SMTA 2015: Indium to Showcase Indium8.9HF Halogen-Free, No-Clean Solder Paste

SMTA 2015: Indium to Showcase Indium8.9HF Halogen-Free, No-Clean Solder Paste

Indium Corporation will feature Indium8.9HF, a halogen-free, no-clean solder paste with excellent performance stability during printing, at the SMTA International Conference Sept. 27-Oct. 1 in Rosemont, Ill. [More]
Ultrafast Plasmonic Device Could Form the Basis for Optical Computers

Ultrafast Plasmonic Device Could Form the Basis for Optical Computers

A team of researchers at Duke University has developed an ultrafast plasmonic device, which can turn on and off 90 billion times per second. [More]
Complex, Scalable Arrays of Semiconductor Heterojunctions Hold Potential for Future Electronics

Complex, Scalable Arrays of Semiconductor Heterojunctions Hold Potential for Future Electronics

A team of researchers at the Oak Ridge National Laboratory, Department of Energy, has integrated a new synthesis process with standard electron-beam lithography methods to create complex and scalable arrays of semiconductor heterojunctions in random patterns within a nanometer-thick semiconductor crystal. This unique process depends on converting patterned areas of a single-layer crystal into another layer of crystal. The study has been published in Nature Communications. [More]
Wireless, 3D-Printed Smart Cap Detects Spoiled Food Using Embedded Sensors

Wireless, 3D-Printed Smart Cap Detects Spoiled Food Using Embedded Sensors

A team of engineers from UC Berkeley along with colleagues at Taiwan’s National Chiao Tung University has further extended the scope of 3D printing technology by using the novel technique to create electrical parts such as capacitors, inductors, resistors, and integrated wireless electrical sensing solutions. [More]
Molybdenum Disulfide Holds Promise as Material for LED Manufacture

Molybdenum Disulfide Holds Promise as Material for LED Manufacture

Researchers from the California NanoSystems Institute at UCLA have successfully established electroluminescence from multilayer molybdenum disulfide (MoS2) for the first time. [More]
“White Graphene” Structures Could Prevent Over-Heating in Future Electronics

“White Graphene” Structures Could Prevent Over-Heating in Future Electronics

Researchers at Rice University have discovered that 3D structures of boron nitride, sometimes called "white graphene", could be used to control heat flow in small electronic devices. [More]
Oxford Instruments PlasmaPro® Systems Ordered by Chinese HB-LED Manufacturer

Oxford Instruments PlasmaPro® Systems Ordered by Chinese HB-LED Manufacturer

High tech Chinese manufacturer, Enraytek Optoelectronics Co has recently ordered several leading edge Oxford Instruments PlasmaPro 800 PECVD systems for the manufacture of their High Brightness LEDs. [More]
Nordson ASYMTEK to Display New Programmable Tilt + Rotate 5-Axis Fluid Dispenser at SEMICON West 2015

Nordson ASYMTEK to Display New Programmable Tilt + Rotate 5-Axis Fluid Dispenser at SEMICON West 2015

Nordson ASYMTEK, a Nordson company, a global leader in dispensing, jetting, and coating equipment and technologies, announces its new Programmable Tilt + Rotate 5-Axis Fluid Dispenser that enables the jet to dispense using 5 axes of automated control instead of only 3 axes. [More]
Black Phosphorus Could Emerge as Strong Contender to Silicon

Black Phosphorus Could Emerge as Strong Contender to Silicon

Researchers from McGill University and Université de Montréal have suggested that black phosphorus could emerge as a strong contender to silicon as it allows more transistors to be packed on a chip. [More]