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Lockheed Martin’s GPS III Satellite Successfully Completes Critical System-Level Thermal Vacuum Testing

Lockheed Martin’s GPS III Satellite Successfully Completes Critical System-Level Thermal Vacuum Testing

Engineers at Lockheed Martin recently proved their design for the world’s most powerful Global Positioning System (GPS) satellite can operate in and withstand the harsh conditions it will experience on orbit. [More]
EuroCPS Calls for Innovative Cyber-Physical System Projects

EuroCPS Calls for Innovative Cyber-Physical System Projects

CEA-Leti, coordinator of the pan-European consortium EuroCPS, today announced that the 15 partners are continuing their support for SMEs, midcaps and large companies with the second open call for industrial projects, which is open from Oct. 28 to Dec. 2. Innovative cyber-physical system (CPS) projects can be submitted. [More]
The First 3D Printer is Being Sent into Space

The First 3D Printer is Being Sent into Space

A 3D printer is being sent to the International Space Station (ISS) by a collaborative team comprised of aerospace manufacturers Made In Space and Lowe's Innovation Labs. The 3D printer is expected to increase the operational capacity of the ISS. [More]
Advion’s nano LC Ion Source Receives BCEIA New Product Innovation Award

Advion’s nano LC Ion Source Receives BCEIA New Product Innovation Award

Advion, Inc., a leading systems and consumables developer for the life sciences industry, and operating division of Bohui Innovation Technology, announces that its nano LC ion source, Chip-Mate, received a new product innovation award at this week's BCEIA conference and exhibition being held this week in Beijing. [More]
CPI to Collaborate with REMEDIES Project Partners to Develop Smart Pharmaceutical Packaging

CPI to Collaborate with REMEDIES Project Partners to Develop Smart Pharmaceutical Packaging

The Centre for Process Innovation (CPI) is part of a UK based consortium developing technologies that will spearhead the commercialisation of intelligent pharmaceutical packaging.
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Innovative Technique to Produce Hair-Like Strands Using Low-Cost 3D Printer

Innovative Technique to Produce Hair-Like Strands Using Low-Cost 3D Printer

Researchers at Carnegie Mellon University (CMU) have discovered a technique to produce 3D-printed hair-like fibers, bristles and strands using an inexpensive, commonly available 3D printer. [More]
Creaform’s New VXmodel Software Release Features Direct Transfer to SOLIDWORKS

Creaform’s New VXmodel Software Release Features Direct Transfer to SOLIDWORKS

Creaform, worldwide leader in portable 3D measurement solutions and engineering services, announced today the latest upgrade to its scan-to-CAD software module. Part of VXelements, Creaform’s 3D software platform and application suite, VXmodel features a new collaborative functionality for direct transfer to Dassault Systèmes SOLIDWORKS and streamlined workflows for reverse engineering and additive manufacturing in scan-to-CAD to print. [More]
ENR Honors Florida Poly’s Innovation, Science and Technology Building with Global Project of the Year Award

ENR Honors Florida Poly’s Innovation, Science and Technology Building with Global Project of the Year Award

Florida Polytechnic University’s iconic Innovation, Science and Technology (IST) Building has won this year's Global Project of the Year award from Engineering News-Record (ENR), a leading construction industry trade publication. [More]

Granta Announces Latest Programme of Free Materials-Focused Webinars for Engineering Enterprises and Materials Educators

Granta Design today announced a wide-ranging series of free web seminars on topics related to materials information and materials engineering for engineering enterprises and university-level educators. More than 20 ne... [More]
Innovative Assembly Method Quickly Transforms 2D Structures into Complex 3D Shapes

Innovative Assembly Method Quickly Transforms 2D Structures into Complex 3D Shapes

Researchers from the Northwestern University, Tsinghua University and the University of Illinois have developed a method that uses cuts in a material to assemble complex 3D nano- and microstructures from materials like silicon. [More]