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Metal-Containing Compound Shows Potential for Photolithography Applications

Metal-Containing Compound Shows Potential for Photolithography Applications

A team of researcher have developed a novel a metal-containing compound, which changes to a solid with exposure to light and on heating returns back to liquid form. The study was headed by Professor MOCHIDA Tomoyuki from Kobe University Graduate School of Science and Dr. FUNASAKO Yusuke from Tokyo University of Science, Yamaguchi. [More]
Flexible, One Component, Fast Curing Silicone for Medical Device Applications

Flexible, One Component, Fast Curing Silicone for Medical Device Applications

Master Bond MasterSil 910Med is a one part acetoxy type silicone system that meets USP Class VI specifications for biocompatibility and ISO 10993-5 testing for cytotoxicity. [More]
New Water-Soluble Adhesive Gel Could Benefit Tissue Repair and Drug Delivery Processes

New Water-Soluble Adhesive Gel Could Benefit Tissue Repair and Drug Delivery Processes

Scientists have successfully developed a thin, water-soluble, nonpermanent adhesive gel that can be utilized in the field of biomedical applications. Developed from a naturally occurring chemical reaction, this water-soluble adhesive could be useful for drug delivery or tissue repair. The researchers from LSU and the University of Sheffield collaborated for this study, which has been reported in the scientific journal, Angewandte Chemie. [More]
University Research Group Utilise the Systech 8001 OTR Analyser to Test the Oxygen Barrier Properties of Biodegradable Packaging Materials

University Research Group Utilise the Systech 8001 OTR Analyser to Test the Oxygen Barrier Properties of Biodegradable Packaging Materials

The University of Helsinki is at the forefront of international research and doctoral education. The quality of the University's research is reflected in the high number of Centres of Excellence, Academy Professors, Fellows and Researchers. [More]
Toughened One Component Epoxy for Chip Coating Applications Meets NASA Low Outgassing Specifications

Toughened One Component Epoxy for Chip Coating Applications Meets NASA Low Outgassing Specifications

Formulated for many electronic applications, Master Bond Supreme 3HTND-2CCM is a multifunctional epoxy that is well suited for chip coating, glob top and die attach applications as well as for bonding, sealing and encapsulation. [More]
Wika Group Adopts Hercules® Lithography Track System from EV Group for Pressure Sensor Manufacturing

Wika Group Adopts Hercules® Lithography Track System from EV Group for Pressure Sensor Manufacturing

Demand for EVG lithography solutions continues to grow for both mainstream and specialized applications requiring highly customizable solutions [More]
Mussel-Inspired Adhesive Holds Potential for Surgical and Biomedical Applications

Mussel-Inspired Adhesive Holds Potential for Surgical and Biomedical Applications

Purdue University researchers have shown that a synthetic version of a high-strength adhesive produced by mussels is non-toxic to living cells, suggesting its potential suitability for surgical and other biomedical applications. [More]
New Silicone Pressure Sensitive Adhesives from Dow Corning for Medical Device Applications

New Silicone Pressure Sensitive Adhesives from Dow Corning for Medical Device Applications

Dow Corning has launched its new series of silicone pressure sensitive adhesives (PSAs) at MD&M West 2016. The new Dow Corning® MG-2XXX Series of four PSAs have superior strength and adapt to medical devices used for prolonged periods without sensitizing or irritating the skin. The PSAs provide high permeability to water vapor and gas, thus enabling them to be suitable for various medical applications requiring increased aeration. These high-performance adhesives are displayed at Dow Corning’s booth. [More]
New EMS 618-116 Conductive Adhesive Released for Circuit Assembly Applications

New EMS 618-116 Conductive Adhesive Released for Circuit Assembly Applications

Engineered Materials Systems, a leading global supplier of conductive interconnect materials for circuit assembly applications, announces the introduction of its new EMS 618-116 Adhesive. The low-temperature cure one-part conductive adhesive has been designed for circuit assembly applications. [More]
UCSB Develops New Underwater Adhesive Inspired by Sandcastle Worms

UCSB Develops New Underwater Adhesive Inspired by Sandcastle Worms

A new underwater adhesive substance has been developed by UC Santa Barbara’s interdisciplinary group of researchers. This adhesive can be used for a variety of non-biological and biomedical applications. Areas that could benefit from this glue, include dental adhesion, tissue repair and other surface adhesion applications which are usually done under adverse conditions like in aqueous solutions with organic impurities and salty sea water. [More]