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EVT Introduces ChipEye 5Side ChipControl Command Set with 5 Side Inspection

EVT Introduces ChipEye 5Side ChipControl Command Set with 5 Side Inspection

EVT presents with ChipEye 5Side the ChipControl command set with 5 side inspection as a complete system. [More]
Ultrafast Electron-Based Imaging Technique Holds Promise for Designing Improved Semiconductors

Ultrafast Electron-Based Imaging Technique Holds Promise for Designing Improved Semiconductors

Researchers at Michigan State University have developed an ultrafast electron-based imaging technique that makes it possible to modify the electronic properties of materials such that easy transmission of an electrical current is made possible. [More]
Novel Method to Synthesize 2D Black Arsenic Phosphorous Material with Incredible Properties

Novel Method to Synthesize 2D Black Arsenic Phosphorous Material with Incredible Properties

Scientists at the USC Viterbi School of Engineering (USC Viterbi) have collaborated with the Technische Universität München, Universität Regensburg and Yale University, to develop an innovative method for synthesizing black arsenic-phosphorous with amazing properties. [More]
Leading IC Manufacturer Places Follow-On Order for Aehr Test Systems’ ABTS Systems

Leading IC Manufacturer Places Follow-On Order for Aehr Test Systems’ ABTS Systems

Aehr Test Systems, a worldwide supplier of semiconductor test and burn-in equipment, today announced that it has received a $1.7 million follow-on order for its Advanced Burn-in and Test Systems (ABTS) from a leading multi-national manufacturer of advanced logic integrated circuits (ICs) for automotive, embedded processing, digital signal processing and analog applications. The order includes prepayments in order to lock in short lead times and special pricing, and the systems are expected to ship within the next six months. [More]
Exagan to Produce High-Speed Power Switching Devices on 200mm Wafers with €5.7 Million First-Round Financing

Exagan to Produce High-Speed Power Switching Devices on 200mm Wafers with €5.7 Million First-Round Financing

Exagan, a start-up innovator of gallium-nitride (GaN) semiconductor technology that enables smaller and more efficient electrical converters, today announced it has raised €5.7 million in first-round financing that will be used to produce high-speed power switching devices on 200mm wafers. [More]
EVT Releases Wafer Particle Inspection Software for the Semiconductor Industry

EVT Releases Wafer Particle Inspection Software for the Semiconductor Industry

The wafer production for the semiconductor industry is a serious business. Therefore EVT has now with the EyeVision software, developed a program for particle inspection. [More]
Computex 2015: Advanced Semiconductor Engineering to Exhibit System-in-Package Applications

Computex 2015: Advanced Semiconductor Engineering to Exhibit System-in-Package Applications

Advanced Semiconductor Engineering, Inc, the world’s largest semiconductor assembly and test service provider, today announced it will be showcasing System in Package (SiP) solutions in consumer applications at Computex 2015, scheduled to take place in Taipei, Taiwan, over June 2-5, 2015. [More]
PCIM Europe 2015: H.C. Starck to Highlight Refractory Material Products for Power Semiconductor and Thermal Management

PCIM Europe 2015: H.C. Starck to Highlight Refractory Material Products for Power Semiconductor and Thermal Management

H.C. Starck leads the technology metals industry with its engineered products fabricated from refractory materials for the power semiconductor and thermal management industries.H.C. Starck’s custom-engineered thermal management materials support the electronicsindustry’s migration to increased miniaturization of electronic components that require rapid cooling to be effective. [More]
IBM Develops New Silicon Photonics Technology for Cloud Computing and Big Data Applications

IBM Develops New Silicon Photonics Technology for Cloud Computing and Big Data Applications

IBM engineers have developed a CMOS integrated nano-photonics technology that would help in producing 100Gb/s optical transceivers. This latest development will enable datacenters to provide higher data rates and bandwidth for Big Data and cloud computing applications. [More]
Defects in Thin 2D Semiconductor Material Produce Quantum Dots

Defects in Thin 2D Semiconductor Material Produce Quantum Dots

University of Rochester researchers have generated light-emitting quantum dots using defects in an atomically thin semiconductor. The quantum dots initiate the production of single photons and are capable of combining quantum photonics and solid-state electronics, which is collectively called as integrated photonics. [More]