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Boron Nitride Encapsulation Improves Performance of 2D Semiconductor

Boron Nitride Encapsulation Improves Performance of 2D Semiconductor

Researchers at the Japanese National Institute of Materials Science, Danish Technical University, Yonsei University in Korea, University of Minnesota, Cornell, Harvard and Columbia Engineering have improved the performance of molybdenum disulfide (MoS2), a 2D material by encapsulating it in an insulating material, boron nitride (BN). [More]
Researchers Develop New Three-Atomic-Layer-Thick Semiconducting Material with Exotic Properties

Researchers Develop New Three-Atomic-Layer-Thick Semiconducting Material with Exotic Properties

Researchers have successfully created a new three-atomic-layer-thick semiconducting material. The novel material has electronic properties better than conventional semiconductors. The material’s two nano-engineered configurations have exhibited improved light response. [More]
HiPoSwitch Project Develops High-Efficiency, Lightning-Fast Gallium Nitride Power Switches

HiPoSwitch Project Develops High-Efficiency, Lightning-Fast Gallium Nitride Power Switches

The European HiPoSwitch project has developed novel nitride (GaN) transistors for high efficiency, high speed gallium nitride power switches. [More]
New Ultrathin Flexible Material Capable of Changing Colour on Demand

New Ultrathin Flexible Material Capable of Changing Colour on Demand

An ultrathin flexible material developed by the researchers at the University of California at Berkeley behaves as a chameleon-like skin by changing colour on demand during the application of force. [More]
Episil Semiconductor Wafer Commences Operations with AIXTRON Reactor for SiC Epitaxy

Episil Semiconductor Wafer Commences Operations with AIXTRON Reactor for SiC Epitaxy

AIXTRON SE, a worldwide leading provider of deposition equipment to the semiconductor industry, today announced that Taiwanese group Episil Semiconductor Wafer, Inc. has successfully put into operation an AIX G5 WW (Warm-Wall) reactor for silicon carbide (SiC) epitaxy. [More]
Advanced Semiconductor Engineering Becomes a Member of Electronics Industry Citizenship Coalition

Advanced Semiconductor Engineering Becomes a Member of Electronics Industry Citizenship Coalition

Advanced Semiconductor Engineering, Inc. announced today that it has joined the Electronics Industry Citizenship Coalition (EICC), the world’s largest industry coalition committed to creating shared value for the businesses, people, and communities who collectively contribute to the manufacture of electronic devices around the world. ASE’s membership further represents the Company’s resolve to align and work with suppliers and partners that share similar values regarding sustainability. [More]
Innovative Method of Soldering Semiconductors Improves Electron Mobility

Innovative Method of Soldering Semiconductors Improves Electron Mobility

Professor Dmitri Talapin of the University of Chicago has led a team of researchers who have developed a new method to solder semiconductors. This study, which Talapin had conducted along with his associates from UChicago, the Illinois Institute of Technology and the Argonne National Laboratory, proposes an innovative method that enables semiconductors to retain their ability to deliver good electronic performance even after being soldered. [More]
New Silicon Nanofibers Could Boost Lithium-Ion Batteries Used in Electric Vehicles

New Silicon Nanofibers Could Boost Lithium-Ion Batteries Used in Electric Vehicles

Scientists at Bourns College of Engineering of the University of California, Riverside (UC Riverside) have created a new material for lithium-ion batteries that contains sponge-like silicon nanofibers. This paper-like material is over 100X thinner than human hair and could significantly improve the specific energy or the quantity of energy that can be supplied per unit weight of the battery. This latest breakthrough holds promising applications in batteries for personal electronics and electric cars. [More]
CyberOptics to Showcase SQ3000 3D Automated Optical Inspection System at IPC APEX EXPO

CyberOptics to Showcase SQ3000 3D Automated Optical Inspection System at IPC APEX EXPO

CyberOptics® Corporation, a leading global developer and manufacturer of high-precision 3D sensing technology solutions, announces that it will demonstratethe new SQ3000™ 3D Automated Optical Inspection (AOI) system in Booth #3332 at the IPC APEX EXPO, Feb. 24-26, 2015 at the San Diego Convention Center in California. [More]
ClassOne Acquires Spin Rinse Dryer and Spray Solvent Tool Families from Microprocess Technologies

ClassOne Acquires Spin Rinse Dryer and Spray Solvent Tool Families from Microprocess Technologies

ClassOne Technology, the wet-chemistry semiconductor equipment manufacturer, has announced the acquisition of two complete product lines from Microprocess Technologies. Included in the acquisition are the Microprocess Spin Rinse Dryer (SRD) and Spray Solvent Tool (SST) families — which have become ClassOne’s Trident™ SRD and SST lines. The news was jointly announced by Byron Exarcos, President of ClassOne, and Charles Brown, President of Microprocess Technologies. [More]