Hitachi Cable, Ltd. hereby announces that it has developed a new mass-production technology for GaN-templates (Fig. 1), in which a high-quality gallium nitride (GaN) single-crystal thin film is grown on a sapphire substrate, and it will start selling these templates.
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Suntron Corporation, a leader in integrated electronics manufacturing systems (EMS), announces that it offers a variety of manufacturing services, including large scale integration, for semiconductor capital equipment companies.
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STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today announced that its Fully-Depleted Silicon-on-Insulator (FD-SOI) technology was honored with the Energy Technology Award at a ceremony for the 2013 Annual Creativity in Electronics (ACE) Awards, presented by EETimes and EDN, two of the most prominent trade-media sources in electronics.
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Researchers from North Carolina State University have solved a long-standing materials science problem, making it possible to create new semiconductor devices using zinc oxide (ZnO) – including efficient ultraviolet (UV) lasers and LED devices for use in sensors and drinking water treatment, as well as new ferromagnetic devices.
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NXP Semiconductors N.V. today announced at Cards & Payments Singapore that it is near completion of its part of the 172m pieces supplied into the eKTP project.
Launched in 2011, the eKTP project is one of the ...
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Qcept Technologies Inc. today announced that it has received an order for multiple ChemetriQ® 5000 non-visual defect (NVD) inspection systems from one of the world's leading semiconductor device manufacturers.
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The ibss Group introduced the GV10x Downstream (DS) Asherin in 2009, which is employed by the semiconductor industry for removal of hydrocarbon contamination from CD-SEMs and Review SEMs. The company recently reported the use of the GV10x successfully at Infineon and in Hydro.
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SmartKem Limited, the developer of high performance, organic semiconductor materials for flexible electronics, today announced the launch of a pioneering ink evaluation kit which utilises the company’s scientific expertise to significantly streamline the process of producing prototype flexible thin film transistors (TFTs).
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Vishay Intertechnology, Inc. today released a new n-channel TrenchFET® power MOSFET in the thermally enhanced PowerPAK® SO-8 package that extends the company's ThunderFET® technology to 150 V.
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United Microelectronics Corporation ("UMC"), a leading global semiconductor foundry, today announced the three-year plan to improve resource and energy productivity and to reduce greenhouse emission.
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