Copper foam, now available from Goodfellow, combines the outstanding thermal conductivity of copper with the structural benefits of a metal foam. These features are of particular interest to design engineers working in the fields of medical products and devices, defence systems and manned flight, power generation, and the manufacture of semiconductor devices.
It is a true skeletal structure - not a sintered, coated, or plated product - and its purity is typically that of the parent alloy metal, with no voids, inclusions or entrapments. The matrix of cells and ligaments is completely repeatable, regular and uniform throughout the material, yielding a rigid, highly porous and permeable structure with a controlled density of metal per unit volume.
Characteristics of copper foam include:
- Optimal heat transfer
- High strength-to-weight ratio
- High surface area-to-volume ratio
- Isotropic load response
- Controlled stress-strain characteristics
- Can be brazed
- Can be coated and plated
Copper foam is available from Goodfellow in standard pore sizes of 5, 10, 20 and 40 pores per inch (2, 4, 8 and 16 pores per cm), with a density range of 3 to 12%. However, the foam can be compressed to achieve higher densities (up to about 70%) and smaller pore sizes (as high as approximately 500 pores per inch / 200 pores per cm).
For more information about copper foam, call Goodfellow on 0800 731 4653 (UK) or +44 1480 424 800, email email@example.com or go to "New Products" in the News section of www.goodfellow.com.
For more than 40 years, the Goodfellow name has been synonymous with small quantities of high-quality metals, polymers, ceramics and other materials that meet the research, development, and specialised production requirements of science and industry worldwide. Goodfellow Cambridge Ltd. is part of the Goodfellow Group of Companies, which also includes The Technical Glass Company (UK), Goodfellow Corporation, Goodfellow SARL, Goodfellow GmbH, and the Shanghai Representative Office of Goodfellow Cambridge Ltd.