Hot Melt Adhesive Bonds Difficult Substrates Such as Polyethylene and Polypropylene
Published on May 14, 2009 at 9:02 PM
Master Bond MB514 polypropylene adhesive etches away at the bonding challenges presented by non-polar and low energy polyolefin surfaces. Typically, a pretreatment stage, which may include flame treatment, etching or roughening, is required before being able to bond polyolefin substrates. Specially formulated to eliminate this time consuming stage, the MB514 polyolefin based hot melt is particularly suited for use on untreated surfaces of polyethylene, polypropylene and combinations of these substrates.
The only required processing steps are melting these compositions and then applying the molten hot melt to the surfaces to be bonded. Excellent bond performance is retained over a temperature range of -20°F to 190°F (-29°C to 88°C). MB514 adhesive is VOC free as it is comprised of 100% solids and contains no solvents. Bond strengths develop rapidly with no need for clamps or post cure during assembly. One of the main advantages of this polypropylene adhesive is the rapid speed of cure, which makes it ideal for high-speed assembly operations as the bonds are formed immediately upon cooling.