By Cameron Chai
Applied Materials will display its advanced technologies for manufacturing next-generation microchips at 2011 Semicon West event being conducted in San Francisco.
Over the past few weeks, Applied Materials has rolled out eight products to tackle the major production challenges in a new era of chip design difficulty. The eight latest products are developed to reveal the potential of high performance equipment ranging from highly sophisticated transistor gate structures to interconnect wiring. The products include the Producer NanocureTM 3, the Producer Black Diamond 3, the Centura Integrated Gate Stack, the Endura HAR Cobalt PVD, the Endura Versa XLRTM W PVD, the Centura DPN HD, the Vantage VulcanTM RTP and the Reflexion GT CMP for tungsten.
The Chairman and Chief Executive Officer at Applied Materials, Mike Splinter stated that the company is happy to introduce new semiconductor technologies for producing the most difficult and important structures in latest chip designs. These new products from the company’s Silicon Systems Group will allow chip manufacturers to tackle the variations in new materials and designs that will guide in the development of high performance, more connected and smarter mobile instruments, he added.
According to Randhir Thakur, who serves as Silicon Systems Group’s Executive Vice President and General Manager, the company’s advanced technology products offer integration solutions to customers that can reduce process development duration. The company’s relationship with global research and development centers and customers allow it to offer various products for producing three-dimensional packaging and architectures, interconnects and sophisticated transistors, he added.