Powertech Technology (PTI), a Taiwan-based firm specializing in packaging and testing ICs, has purchased a 300 mm Stratus electrochemical deposition (ECD) system from NEXX Systems, a chief supplier of advanced packaging equipment.
Re-distribution of layers in superior packaging applications allows devices such as tablet PCs and smart phones, and copper pillar bumps to be utilized by the Stratus system. As a part of the PTI’s TSV commercialization campaign by PTI, the assessment of Stratus system is being done. PTI has recently collaborated with global leading semiconductor firms in order to develop devices with more efficiency.
PTI is an expert in memory device assembly. According to Scott Jewler, Senior General Manager of PTI, the advanced process technologies are provided by PTI to the fabless companies and main producers of integrated devices in large-scale production environment. The Stratus system will enable PTI to deliver premiere technology solutions like the copper pillar bumps, thus passing the advantages of a flexible system with significant cost savings.
Tom Walsh, CEO of NEXX Systems, stated that PTI is receiving support from NEXX in supply the market with advanced packaging solutions. Walsh added that PTI is renowned for manufacturing efficient, lighter and thinner electronic devices by employing sophisticated packaging solutions in large-scale production.
Source: http://www.nexxsystems.com/