By Cameron Chai
At DesignCon 2012, 3M Electronic Solutions Division will offer samples of new Embedded Capacitance Material (ECM). The new line of ECM solutions has high capacitance density and they are halogen-free.
Earlier versions of ECM from 3M have the highest capacitance density of about 10 nF psi, whereas capacitance density of the newest ECM offerings range from 20 nF per square inch to 40 nF psi.
The new halogen-free solutions will enable design engineers to significantly enhance power integrity and minimize electromagnetic interference (EMI). In addition, they aid them to deliver higher speed digital signals, high signal-to-noise ratio in radio frequencies and hi-fidelity signals in a wide range of applications including consumer electronics, integrated circuit (IC) packaging, microphones, high-performance RF boards and small form factor PC hardware. Engineers can now significantly reduce high-frequency noise with the use of 3M’s new line of highest capacitance density ECM solutions.
As one of the high-capacitance density solutions in the market, the ECM material can be implanted into integrated circuit chip packages and printed circuit boards (PCBs). Also, the high-capacitance and halogen-free ECM material can be used in microphone manufacturing, as it helps in miniaturization of devices as well as contributes to major RFI reduction. The new line of ECM material is RoHS compliant.
Source: http://solutions.3m.com/