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Nordson’s Plasma System Lowers Handling Risk to Sensitive Substrate Materials

Published on July 10, 2012 at 8:24 AM

By G.P. Thomas

Nordson MARCH has launched the new FasTRAK Plasma System, which is a high-throughput, fully-automated, vacuum plasma treatment system developed for laminate substrates, lead-frame strips, and other strip-type microelectronic components.

Based on the advanced robotic movement, the FasTRAK Plasma System incorporates the complete known range of magazines and strip, length, width and thickness dimensions. The highly efficient, field-proven robotics was designed specifically for reducing the handling risk to the sensitive substrate materials deploying minimal pulling, pushing, and low G-forces.

The FasTRAK System consists of a novel material tracking software application in addition to an internal camera for calculating the number of strips and tracking their progress all through the treatment process, ensuring 100% treatment validation. It can hold up to 10 strips per batch with maximum units per hour (UPH) treatment rate. The FasTRAK Plasma System measures 1.65 m in width and 1.5 m in depth and >35% smaller system footprint than earlier strip processing models.

In addition, the FasTRAK System features a new application-specific plasma chamber that is highly efficient, and capable of being configured for direct or ion-free plasma modes. Typical plasma is effective for pre-underfill for minimal voiding, pre-die attach for better adhesion, pre-mold to minimize delamination, pre-wire bond for stronger pull strength and CpKs, and post-mold for flash elimination.

Plasma experts from Nordson MARCH will exhibit the FasTRAK Plasma System at the SEMICON West Show, from July 10 to 12, 2012 at the Moscone Center in San Francisco, CA, USA.

Source: http://www.nordson.com/

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